Nexperia
PESD5V5HS-SF
Ultra low capacitance bidirectional ESD protection diode
12. Soldering
Footprint information for reflow soldering of leadless ultra small package; 2 terminals
SOD962-2
0.85
0.6
0.2
0.2
0.4
0.2
0.4 0.28
0.256
0.16
0.256
recommended stencil thickness: 0.1 mm
occupied area
solder paste
solder lands
Dimensions in mm
16-02-01
Issue date
sod962-2_fr
20-09-15
Fig. 7. Reflow soldering footprint for DSN0603-2 (SOD962-2)
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PESD5V5HS-SF
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Product data sheet
23 May 2022
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NEXPERIA [ Nexperia ]
