µPD178023, 178024
10. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Table 10-1. Soldering Conditions for Surface-Mount Type
µPD178023GF-XXX-3B9: 80-pin plastic QFP (14 × 20 mm, 0.8-mm pitch)
µPD178024GF-XXX-3B9: 80-pin plastic QFP (14 × 20 mm, 0.8-mm pitch)
Recommended
Soldering Method
Infrared reflow
Soldering Conditions
Conditions Symbol
Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.), IR35-00-3
Number of times: 3 max.
VPS
Package peak temperature: 215 °C, Time: 40 sec max. (200 °C min.), VP15-00-3
Number of times: 3 max.
Wave soldering
Solder bath temperature: 260 °C max., Time: 10 sec max.,
Number of times: 1, Preheating temperature: 120 °C max.,
(Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C max., Time: 3 sec max (per device side)
–
Caution Do not use two or more soldering methods in combination (except partial heating).
µPD178023GC-XXX-8BT: 80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch)
µPD178024GC-XXX-8BT: 80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch)
Recommended
Soldering Method
Infrared reflow
Soldering Conditions
Conditions Symbol
Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.), IR35-00-2
Number of times: 2 max.
VPS
Package peak temperature: 215 °C, Time: 40 sec max. (200 °C min.), VP15-00-2
Number of times: 2 max.
Wave soldering
Solder bath temperature: 260 °C max., Time: 10 sec max.,
Number of times: 1, Preheating temperature: 120 °C max.,
(Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C max., Time: 3 sec max (per device side)
–
Caution Do not use two or more soldering methods in combination (except partial heating).
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Data Sheet U14126EJ1V0DS00
NEC [ NEC ]
