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MU9C4320L-12TDI 参数 Datasheet PDF下载

MU9C4320L-12TDI图片预览
型号: MU9C4320L-12TDI
PDF下载: 下载PDF文件 查看货源
内容描述: 4K ×32的内容可寻址存储器(CAM )具有32位宽的数据接口 [4K x 32 Content Addressable Memory (CAM) with a 32-bit wide data interface]
分类和应用: 存储内存集成电路静态存储器双倍数据速率
文件页数/大小: 32 页 / 449 K
品牌: MUSIC [ MUSIC SEMICONDUCTORS ]
 浏览型号MU9C4320L-12TDI的Datasheet PDF文件第24页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第25页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第26页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第27页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第28页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第30页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第31页浏览型号MU9C4320L-12TDI的Datasheet PDF文件第32页  
Electrical  
MU9C4320L ATMCAM  
Switching Characteristics  
-70  
-90  
-12  
No  
1a  
1b  
2a  
2b  
3
Symbol  
tELEL  
tELEL  
tELEH  
tELEH  
tEHEL  
tCVEL  
tELCX  
tELQX  
tELQV  
Parameter (all times in nanoseconds)  
Chip Enable Cycle Time (Short Cycle)  
Chip Enable Cycle Time (Compare Cycle)  
Chip Enable LOW Pulse Width (Short Cycle)  
Chip Enable LOW Pulse Width (Compare Cycle)  
Chip Enable HIGH Pulse Width  
Min Max Min Max Min Max Notes  
50  
70  
40  
60  
10  
5
50  
90  
40  
75  
10  
8
75  
120  
55  
90  
10  
10  
5
3
4
3
4
4
Control Input to Chip Enable LOW Setup Time  
Control Input to Chip Enable LOW Hold Time  
Chip Enable LOW to Outputs Active  
5
5
6
6
6
7
6
5
3
3
6
5
5
5
7
Chip Enable LOW to Outputs Valid  
Register  
Memory  
40  
50  
10  
40  
70  
10  
50  
80  
15  
8
tEHQZ  
tDVEL  
Chip Enable HIGH to Outputs High-Z  
Data to Chip Enable LOW Setup Time  
Data from Chip Enable LOW Hold Time  
Full In Valid to Chip Enable LOW Setup Time  
Full In Valid to Full Flag Valid  
2
3
3
0
2
3
3
0
2
5
5
3
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
tELDX  
tFIVEL  
tFIVFFV  
tEHFFV  
tEHQX  
tEHQV  
tMIVEL  
tEHMX  
tEHMV  
tMIVMV  
8
9
12  
25  
Chip Enable HIGH to Full Flag Valid  
Chip Enable HIGH to Output Change  
Chip Enable HIGH to Output Valid  
16  
16  
2
2
2
22  
25  
30  
Match In Valid to Chip Enable LOW Setup  
Chip Enable HIGH to Match Flag Change  
Chip Enable HIGH to Match Flag Valid  
Match In Valid to Match Flag Valid  
8
2
10  
2
12  
2
17  
8
20  
9
25  
12  
/MF, /MV  
/MM  
10  
10  
12  
10  
10  
14  
12  
15  
16  
20  
21  
22  
23  
24  
tOEHQZ  
tOELQV2  
tMIVOEL  
tFIVOEL  
tEHRSTL  
Output Enable HIGH to Outputs High-Z  
Output Enable LOW to Match Address Outputs Valid  
Match in Valid to Output Enable LOW  
Full in Valid to Output Enable LOW  
2
2
2
3
3
4
3
3
4
Chip Enable HIGH to Reset LOW  
20  
50  
20  
20  
20  
2
20  
50  
20  
20  
20  
2
25  
70  
25  
25  
25  
2
25 tRSTLRSTH Reset Pulse Width  
8
26  
27  
28  
tRSTHEL  
Reset HIGH to Chip Enable LOW  
tTIVTCLKH Test Input Valid to TCLK HIGH Setup Time  
tTCLKHTIX TCLK HIGH to Test Input Hold Time  
9
9
29 tTCLKLTDOX TCLK LOW to TDO Change  
30 tTCLKLTDOV TCLK LOW to TDO Valid  
31 tTCLKLTDOZ TCLK LOW to TDO High-Z  
10  
20  
10  
20  
15  
25  
20  
20  
25  
Notes:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
-1.0V for a duration of 10ns measured from the 50% amplitude points for input-only lines.  
Common I/O lines are clamped so that transients cannot fall below -0.5V.  
Applies to all cycle types except Compare cycles and Memory Read cycles.  
Applies to Compare cycles.  
Control signals are /CS1, /CS2, /W, /AV, and AC11–0.  
With loads specified in Figure 5.  
With loads specified in Figure 6.  
/E should be HIGH during /RESET active to ensure proper device defaults.  
Test inputs are the TDI and TMS signals.  
10. With output and I/O pins unloaded.  
11. Pins with internal pull-ups are /RESET, TCLK, TMS, TDI, and /TRST.  
Rev. 3  
29  
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