Substrate Bending Test
・Test Substrate
Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
Thickness :
0.8mm
Copper Foil Thickness: 0.035mm
Kind of Solder : Sn-3.0Ag-0.5Cu
b
Land
4.5
Dimension(mm)
b
Series
a
c
a
GRM15
0.4
1.5
0.5
100
Solder Resist (Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Pressurization Method
50min.
Pressurization speed
1.0mm/s
20
Pressurize
R5
Flexure
Capacitance meter
45
45
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability
・Test Substrate
Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
Thickness :
1.6mm or 0.8mm
Copper Foil Thickness: 0.035mm
Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Chip Capacitor
Land
Dimension(mm)
Series
a
b
c
GRM15
0.4
1.5
0.5
a
Solder Resist
b
Fig.3
GRM155B31H104KE14-01A
MURATA [ muRata ]
