Substrate Bending test
Except for Substrate Bending test
・Test substrate
Material
Thickness
・Test substrate
Material
Thickness
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.0mm
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm or 0.8mm
・Land Dimension
・Land Dimension
Dimension(mm)
Dimension(mm)
Type
Type
a
b
c
d
e
f
a
b
c
d
e
0.4
f
NFM18
1.0
2.2
0.6
1.2
0.4
0.4
NFM18
1.0
2.2
0.6
1.2
0.4
・Pressurization Method
NFM18PC474R0J3-0-770
5