APPLICATION SPECIFIC CAPACITORS
HIGH FREQUENCY CERAMIC CAPACITORS
MA/MB Series
DIMENSIONS
Fig. 1 Chip
Fig. 2 Pellet
Fig. 3 Micro-Strip
Fig. 4 Radial Ribbon
L
L
L
L
W
W
W
W
T
T
T
Y
T
Y
Y
Y
Fig. 5 Radial Wire
Fig. 6 Axial Ribbon
Fig. 7 Narrow Axial Ribbon
Fig. 8 Axial Wire
L
L
L
L
W
W
W
T
T
T
Y
T
Y
Y
Y
W
CONFIGURATION AND DIMENSIONS – MA & MB SERIES
Type
Dimensions: mm
Case
Size
Band
Y
Style
Figure
Configuration
Termination
P90 ± ±0 P90 ± ꢀ0 COG
X7R
L ± 0.ꢀ8* W ± 0.ꢀ8* T max.
Chip
MA10
MA11
—
—
MA50 MA70
MA51 MA71
1
2
1.4 .25
Palladium Silver
Palladium Silver
& Sn62 Solder
Pellet
1
EIA
1.8
max.
0.25
.1
Palladium Silver,
Nickel Interface
& Sn62 Solder
Style
0505
1.4 .25
1.4
Nickel Interfaced
Pellet
MA18
MA19
—
—
MA58 MA78
MA59 MA79
2
1
Palladium Silver,
Nickel Interface
& Tin Plating
Nickel Interfaced
Chip
1.4 .25
Chip
MA20
MA21
MB20
MB21
MA60 MA80
MA61 MA81
1
2
2.8
Palladium Silver
Palladium Silver,
& Sn62 Solder
Pellet
3.3 max.
Micro
Strip
Silver Ribbon:
MA22
MA23
MB22
MB23
MA62 MA82
MA63 MA83
3
4
3.4
3.4
6.35 x 2.3 x 0.1mm
Radial
Ribbon
Silver Ribbon:
6.35 x 2.3 x 0.1mm
Radial
Wire
#26AWG Silver Wire:
12.7 x 0.4mm Dia.
MA24
MA25
MA26
MB24
MB25
MB26
MA64 MA84
MA65 MA85
MA66 MA86
5
6
7
3.8
3.4
3.4
2
EIA
0.38
.25
Axial
Ribbon
Style
1010
2.8
2.5
Silver Ribbon:
6.35 x 2.3 x 0.1mm
Narrow Axial
Ribbon
Silver Ribbon:
6.35 x 1.25 x 0.1mm
Axial
Wire
#26AWG Silver Wire:
12.7mm x 0.4mm Dia.
MA27
MB27
MA67 MA87
8
3.8
Palladium Silver,
Nickel Interface
& Sn62 Solder
Nickel Interfaced
Pellet
MA28
MA29
MB28
MB29
MA68 MA88
MA69 MA89
2
1
3.3 max.
2.8
Palladium Silver,
Nickel Interface
& Tin Plating
Nickel Interfaced
Chip
*Except where Tolerance is shown. Lead lengths are typical widths ±±.ꢀ11m thicꢁness ꢂ dia. ±±.±ꢃ11.
All leaded parts are bonded with high te1perature solder 748°F/398°C.
CG01-J
119
MURATA [ muRata ]
