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GRT31CR60J476KE13 参数 Datasheet PDF下载

GRT31CR60J476KE13图片预览
型号: GRT31CR60J476KE13
PDF下载: 下载PDF文件 查看货源
内容描述: [AEC-Q200 Compliant Chip Multilayer Ceramic Capacitors for Infotainment]
分类和应用:
文件页数/大小: 30 页 / 848 K
品牌: MURATA [ muRata ]
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Caution  
5.Washing  
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips  
or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure  
it does not degrade the capacitors.  
6.Electrical Test on Printed Circuit Board  
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a  
capacitor after mounting on the printed circuit board.  
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.  
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder  
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.  
Install support pins as close to the test-probe as possible.  
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.  
[Not Recommended]  
[Recommended]  
Peeling  
Support Pin  
Test-probe  
Test-probe  
7.Printed Circuit Board Cropping  
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that  
caused bending or twisting the board.  
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.  
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.  
Avoid this type of stress to a capacitor.  
[Bending]  
[Twisting]  
2. Check the cropping method for the printed circuit board in advance.  
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router  
type separator, etc.) to prevent the mechanical stress that can occur to the board.  
Board Separation Apparatus  
Hand Separation  
Nipper Separation  
Board Separation Method  
(1) Board Separation Jig  
2) Disc Separator  
3) Router Type Separator  
Level of stress on board  
Recommended  
High  
×
Medium  
*  
Medium  
*  
Low  
· Board handling  
· Layout of slits  
· Board bending direction · Design of V groove  
Hand and nipper  
separation apply a high  
level of stress.  
· Board handling  
Notes  
Board handling  
· Layout of capacitors  
· Arrangement of blades  
· Controlling blade life  
Use another method.  
* When a board separation jig or disc separator is used, if the following precautions are not observed,  
a large board deflection stress will occur and the capacitors may crack.  
Use router type separator if at all possible.  
JEMCGC-01743G  
20  
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