! Caution
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
ꢀꢀꢀꢀꢀ[Standard Conditions for Flow Soldering]
Temperature(℃)
Soldering
Table 2
Soldering
Peak
Temperature
Chip Dimension
(L/W)ꢀCode
Gradual
Cooling
Series
GRT
Temperature Differential
ΔT≦150℃
ΔT
Preheating
Peak
Temperature
18/21/31
Preheating
Time
5 seconds max.
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
30-90 seconds
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
[Allowable Flow Soldering Temperature and Time]
280
270
260
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
250
240
230
220
0
10
20
30
40
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2.
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder
90 to 110℃
240 to 250℃
Air
Lead Free Solder
Preheating Peak Temperature
Soldering Peak Temperature
Atmosphere
100 to 120℃
250 to 260℃
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
Up to Chip Thickness
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
in section
Adhesive
JEMCGC-01743G
18
MURATA [ muRata ]
