Substrate Bending test
Except for Substrate Bending test
・Test substrate
Material
Thickness
・Test substrate
Material
Thickness
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm or 0.8mm
Copper Foil Thickness 0.035mm
Copper Foil Thickness 0.035mm
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
・Land Dimension
・Land Dimension
Dimension(mm)
b
Dimension(mm)
b
Type
Type
a
c
a
c
GRM32
2.2
5.0
2.9
GRM32
2.2
5.0
2.9
・Pressurization Method
GRM32ED71A476ME15-01A
5
MURATA [ muRata ]
