Complement of Test Method
1.Test substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method : Reflow soldering
Solder : Sn-3.0Ag-0.5Cu
(1) Test Substrate A
･Land Dimensions
Chip Capacitor
Dimension (mm)
Type
a
b
c
Land
GRM18
GRM21
GRM31
GRM32
GRM42
GRM43
GRM52
GRM55
1.0
1.2
2.2
2.2
3.5
3.5
4.5
4.5
3.0
4.0
5.0
5.0
7.0
7.0
8.0
8.0
1.2
1.65
2.0
2.9
2.4
3.7
3.2
5.6
a
Solder Resist
b
･Material : Glass Epoxy Board
･Thickness : 1.6mm
･Thickness of copper foil : 0.035mm
(1) Test Substrate B
a
Dimension of pettern (mm)
Type
a
b
c
d
GRM18
GRM21
GRM31
GRM32
GRM42
GRM43
GRM52
GRM55
1.0
1.2
2.2
2.2
3.5
3.5
4.5
4.5
3.0
4.0
5.0
5.0
7.0
7.0
8.0
8.0
1.2
1.65
2.0
2.9
2.4
3.7
3.2
5.6
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
(f4.5)
b
1.6
100
Copper foil
Solder resist
(unit : mm)
･Material : Glass Epoxy Board
･Thickness of copper foil : 0.035mm
2. Test Method of Substrate Bending test
a) Support state
(b) Test state
Test Substrate B
Test Substrate B
a
20
Capacitor
Support stand(f5)
45+/-2
45+/-2
Pressure stick
Test stand
Support stand
(unit : mm)
a:+/-2 gap between support stand center and test stand
·Material of Test stand and pressure stick
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀb:+/-5 gap between support stand center and test stand center
ꢀꢀꢀꢀꢀThe material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
·Pressurizing speed
ꢀꢀꢀꢀꢀThe pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure stick
ꢀꢀꢀꢀꢀ
F
R5
L
Support
stand
JEMCGS-04233D
4
MURATA [ muRata ]
