Notice
2. Land Dimensions
Chip Capacitor
ꢀPlease confirm the suitable land dimension by
Land
evaluating of the actual SET / PCB.
b
a
Solder Resist
Table 1 Flow Soldering Method
ChipꢀDimension
(L/W)ꢀCode
Series
Chip(L×W)
1.6×0.8
a
b
c
GR□
GR□
GR□
18
21
31
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
2.0×1.25
3.2×1.6
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
ChipꢀDimension
(L/W)ꢀCode
Series
GR□
GR□
GR□
GR□
GR□
GR□
GR□
GR□
Chip(L×W)
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.8
5.7×5.0
a
b
c
18
0.6 to 0.8
1.0 to 1.4
1.0 to 2.0
2.0 to 2.4
2.8 to 3.4
3.0 to 3.5
4.0 to 4.6
4.0 to 4.6
0.6 to 0.7
0.6 to 0.8
0.9 to 1.2
1.0 to 1.2
1.2 to 1.4
1.2 to 1.4
1.4 to 1.6
1.4 to 1.6
0.6 to 0.8
1.2 to 1.4
1.5 to 1.7
1.8 to 2.3
1.4 to 1.8
2.3 to 3.0
2.1 to 2.6
3.5 to 4.8
21
31
32
42
43
52
55
(in mm)
<Applicable to beyond Rated Voltage of 200VDC>
2-2. Dimensions of Slit (Example)
Sli
t
Chip
Capacitor
Solder
Resist
Preparing the slit helps flux cleaning and resin coating
on the back of the capacitor.
L
d
However, the length of the slit design should be
as short as possible to prevent mechanical damage
in the capacitor.
Lan
d
d
L×W
A longer slit design might receive more severe
mechanical stress from the PCB.
Recommended slit design is shown in the Table.
e
-
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.8
5.7×5.0
-
-
-
1.0～2.0
1.0～2.0
1.0～2.8
1.0～2.8
1.0～4.0
1.0～4.0
3.2～3.7
4.1～4.6
3.6～4.1
4.8～5.3
4.4～4.9
6.6～7.1
JEMCGC-05049F
24
MURATA [ muRata ]
