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GRM31A7U2H271JW31 参数 Datasheet PDF下载

GRM31A7U2H271JW31图片预览
型号: GRM31A7U2H271JW31
PDF下载: 下载PDF文件 查看货源
内容描述: [Chip Multilayer Ceramic Capacitors for General Purpose]
分类和应用:
文件页数/大小: 28 页 / 1154 K
品牌: MURATA [ muRata ]
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!
Caution  
(3) Example of Router Type Separator  
[ Outline Drawing ]  
Router  
The router type separator performs cutting by a router  
rotating at a high speed. Since the board does not  
bend in the cutting process, stress on the board can  
be suppressed during board separation.  
When attaching or removing boards to/from the router type  
separator, carefully handle the boards to prevent bending.  
8. Assembly  
1. Handling  
If a board mounted with capacitors is held with one hand, the board may bend.  
Firmly hold the edges of the board with both hands when handling.  
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.  
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.  
2. Attachment of Other Components  
2-1. Mounting of Other Components  
Pay attention to the following items, when mounting other components on the back side of the board after  
capacitors have been mounted on the opposite side.  
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied  
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.  
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.  
· Periodically check and adjust the bottom dead point.  
Suction Nozzle  
2-2. Inserting Components with Leads into Boards  
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the  
capacitors or cracks in the solder. Pay attention to the following.  
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.  
· Fix the board with support pins or a dedicated jig before insertion.  
· Support below the board so that the board does not bend. When using support pins on the board,  
periodically confirm that there is no difference in the height of each support pin.  
Component with Leads  
2-3. Attaching/Removing Sockets and/or Connectors  
Insertion and removal of sockets and connectors, etc., might cause the board to bend.  
Please insure that the board does not warp during insertion and removal of sockets and connectors, etc.,  
ꢀꢀ ꢀor the bending may damage mounted components on the board.  
Socket  
2-4. Tightening Screws  
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or  
chassis. Pay attention to the following items before performing the work.  
· Plan the work to prevent the board from bending.  
· Use a torque screwdriver, to prevent over-tightening of the screws.  
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied  
to the chips by forcibly flattening the board when tightening the screws.  
Screwdriver  
JEMCGC-05049F  
20  
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