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GRM2195C1H682JA01D 参数 Datasheet PDF下载

GRM2195C1H682JA01D图片预览
型号: GRM2195C1H682JA01D
PDF下载: 下载PDF文件 查看货源
内容描述: 片状独石陶瓷电容器 [Chip Monolithic Ceramic Capacitors]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 221 页 / 4341 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
!Note  
C02E.pdf  
10.12.20  
sales representatives or product engineers before ordering.  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
GA3 Series Specifications and Test Methods  
Continued from the preceding page.  
No.  
Item  
Specifications  
Test Method  
Appearance  
No defects or abnormalities  
Within the specified tolerance  
Solder the capacitor to the test jig (glass epoxy board).  
The capacitor should be subjected to a simple harmonic motion  
having a total amplitude of 1.5mm, the frequency being varied  
uniformly between the approximate limits of 10 and 55Hz. The  
frequency range, from 10 to 55Hz and return to 10Hz, should be  
traversed in approximately 1 min. This motion should be applied  
for a period of 2 hrs. in each of 3 mutually perpendicular  
directions (total of 6 hrs.).  
Capacitance  
Vibration  
Resistance  
12  
Char.  
X7R  
Specification  
D.F.V0.025  
QU400W20C*2 (CF30pF)  
D.F.  
Q
SL  
QU1000  
(CU30pF)  
Solder resist  
Cu  
Glass Epoxy Board  
No marking defects  
Solder the capacitor to the testing jig (glass epoxy board) shown  
in Fig. 2.  
Then apply a force in the direction shown in Fig. 3. The soldering  
should be done using the reflow method and should be  
conducted with care so that the soldering is uniform and free of  
defects such as heat shock.  
b
φ4.5  
d
c
a
50  
Pressurizing  
speed: 1.0mm/s  
20  
t : 1.6  
100  
13 Deflection  
Pressurize  
Fig. 2  
R230  
LZW  
(mm)  
Dimension (mm)  
Flexure=1  
a
b
c
d
Capacitance meter  
45 45  
4.5Z2.0  
4.5Z3.2  
5.7Z2.8  
5.7Z5.0  
3.5  
3.5  
4.5  
4.5  
7.0  
7.0  
8.0  
8.0  
2.4  
3.7  
3.2  
5.6  
(in mm)  
1.0  
Fig. 3  
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and  
rosin (JIS-K-5902) (25% rosin in weight proportion).  
Immerse in solder solution for 2T0.5 sec.  
Immersing speed: 25T2.5mm/s  
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)  
235T5°C H60A or H63A Eutectic Solder  
Solderability of  
Termination  
14  
75% of the terminations are to be soldered evenly and continuously.  
No marking defects  
Appearance  
Preheat the capacitor as in table. Immerse the capacitor in  
solder solution at 260T5D for 10T1 sec. Let sit at room  
condition*1 for 24T2 hrs., then measure.  
Char.  
X7R  
Capacitance Change  
Within T10%  
Capacitance  
Change  
#Immersing speed: 25T2.5mm/s  
Within T2.5% or T0.25pF  
(Whichever is larger)  
#Pretreatment for X7R char.  
SL  
W 0  
Resistance  
Perform a heat treatment at 150Y10D for 60T5 min. and then  
let sit for 24T2 hrs. at room condition.*1  
15 to Soldering  
Heat  
I.R.  
More than 1,000MΩ  
*Preheating  
Dielectric  
Strength  
In accordance with item No.4  
Step  
1
2
Temperature  
100 to 120D  
170 to 200D  
Time  
1 min.  
1 min.  
*1 "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa  
*2 "C" expresses nominal capacitance value (pF).  
Continued on the following page.  
197