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C02E.pdf
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AC250V(r.m.s.) Type (Which Meet Japanese Law) Specifications and Test Methods
GA2 Series Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Method
No marking defects
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
b
φ4.5
d
c
a
50
Pressurizing
20
t : 1.6
speed: 1.0mm/s
12 Deflection
100
Pressurize
Fig. 2
R230
LZW
(mm)
4.5Z2.0
4.5Z3.2
5.7Z5.0
Dimension (mm)
Flexure=1
a
b
c
d
Capacitance meter
3.5
3.5
4.5
7.0
7.0
8.0
2.4
3.7
5.6
45
45
(in mm)
1.0
Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Solderability of
Termination
13
75% of the terminations are to be soldered evenly and continuously.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance
No marking defects
Capacitance
Change
Within T15%
The capacitor should be subjected to 40T2D, relative humidity of
90 to 98% for 8 hrs., and then removed in room condition* for 16
hrs. until 5 cycles.
Humidity
Insulation
14
D.F.
I.R.
0.05 max.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
No marking defects
Within T10%
Appearance
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
Capacitance
Change
D.F.
0.025 max.
#Pretreatment
Resistance
W 0
ꢀ
Perform a heat treatment at 150Y10D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
15 to Soldering I.R.
Heat
More than 2,000MΩ
*Preheating
Dielectric
Strength
Step
1
2
Temperature
100 to 120D
170 to 200D
Time
1 min.
1 min.
In accordance with item No.4
Appearance
No marking defects
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Capacitance
Change
Within T15%
D.F.
I.R.
0.05 max.
Let sit for 24T2 hrs. at room condition,* then measure.
More than 2,000MΩ
Step
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Time (min.)
30T3
2 to 3
1
2
3
4
Max. Operating Temp.T2
Room Temp.
30T3
2 to 3
Temperature
Cycle
16
#Pretreatment
W 0
Perform a heat treatment at 150Y10D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
Dielectric
Strength
In accordance with item No.4
Solder resist
Cu
Glass Epoxy Board
Fig. 4
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
189
MURATA [ muRata ]
