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C02E.pdf
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Medium Voltage High Capacitance for General Use Specifications and Test Methods
GRM Series Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Method
No marking defects
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
b
φ4.5
d
c
a
50
Pressurizing
20
t : 1.6
speed: 1.0mm/s
100
Pressurize
11 Deflection
Fig. 2
R230
LZW
(mm)
Dimension (mm)
Flexure=1
a
b
c
d
1.6Z0.8
2.0Z1.25
3.2Z1.6
3.2Z2.5
4.5Z3.2
5.7Z5.0
1.0
1.2
2.2
2.2
3.5
4.5
3.0
4.0
5.0
5.0
7.0
8.0
1.2
1.65
2.0
2.9
3.7
5.6
Capacitance meter
45
45
(in mm)
1.0
Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Solderability of
Termination
12
75% of the terminations are to be soldered evenly and continuously.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
*
Appearance No marking defects
Preheat the capacitor at 120 to 150°C for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
•Immersing speed: 25±2.5mm/s
Capacitance
Change
Within ±10%
D.F.
I.R.
0.025 max.
•Pretreatment
Perform a heat treatment at 150
let sit for 24±2 hrs. at room condition.*
Resistance
13 to Soldering
Heat
+ 0
–10
°C for 60±5 min. and then
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
*Preheating for more than 3.2Z2.5mm
Dielectric
Strength
Step
1
2
Temperature
100 to 120°C
170 to 200°C
Time
1 min.
1 min.
In accordance with item No.4
Appearance No marking defects
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Capacitance
Within ±7.5%
Change
D.F.
I.R.
0.025 max.
Let sit for 24±2 hrs. at room condition,* then measure.
Step
Temperature (°C)
Min. Operating Temp.±3
Room Temp.
Time (min.)
30±3
2 to 3
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
1
2
3
4
Max. Operating Temp.±2
Room Temp.
30±3
2 to 3
Temperature
14
Cycle
•Pretreatment
Perform a heat treatment at 150
+ 0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Dielectric
Strength
In accordance with item No.4
Solder resist
Cu
Glass Epoxy Board
Fig. 4
Appearance No marking defects
Capacitance
Within ±15%
Change
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
+24
for 500
hrs.
– 0
Humidity
15 (Steady
State)
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
D.F.
I.R.
0.05 max.
CU0.01µF: More than 10MΩ • µF
CF0.01µF: More than 1,000MΩ
•Pretreatment
Perform a heat treatment at 150
+ 0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Dielectric
Strength
In accordance with item No.4
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
169
MURATA [ muRata ]
