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C02E.pdf
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Medium Voltage Low Dissipation Factor Specifications and Test Methods
GRM Series Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Method
No marking defects
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
b
φ4.5
d
c
a
50
Pressurizing
speed: 1.0mm/s
20
t : 1.6
100
11 Deflection
Pressurize
R230
Fig. 2
LZW
(mm)
2.0Z1.25
3.2Z1.6
3.2Z2.5
4.5Z2.0
Dimension (mm)
Flexure=1
a
b
c
d
Capacitance meter
1.2
2.2
2.2
3.5
4.0
5.0
5.0
7.0
1.65
2.0
2.9
2.4
(in mm)
45
45
1.0
Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in
solder solution for 2T0.5 sec.
Solderability of
Termination
75% of the terminations are to be soldered evenly
and continuously.
12
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
*
Appearance
No marking defects
Preheat the capacitor at 120 to 150D for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1 sec.
Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
Capacitance
Change
Within T2.5%
Resistance
13 to Soldering
Heat
Q
1,000 min.
*Preheating for more than 3.2Z2.5mm
I.R.
More than 10,000MΩ
Step
1
2
Temperature
100 to 120D
170 to 200D
Time
1 min.
1 min.
Dielectric
Strength
In accordance with item No.4
Appearance
No marking defects
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Capacitance
Change
Within T2.5%
Q
500 min.
Let sit for 24T2 hrs. at room condition,* then measure.
I.R.
More than 10,000MΩ
Step
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Max. Operating Temp.T2
Room Temp.
Time (min.)
30T3
2 to 3
30T3
2 to 3
1
2
3
4
Temperature
14
Cycle
Dielectric
Strength
In accordance with item No.4
Solder resist
Cu
Glass Epoxy Board
Fig. 4
Appearance
No marking defects
Capacitance
Change
Within T5.0%
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
ꢀ
Humidity
15 (Steady
State)
W24
Q
350 min.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
I.R.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
No marking defects
Within T3.0%
W48
Appearance
Apply voltage as in Table for 1,000Y 0hrs. at maximum
operating temperature T3D.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
Capacitance
Change
Q
350 min.
16 Life
Rated Voltage
DC250V
Applied Voltage
150% of the rated voltage
I.R.
More than 1,000MΩ
DC630V, DC1kV,
DC2kV, DC3.15kV
120% of the rated voltage
Dielectric
Strength
In accordance with item No.4
The charge/discharge current is less than 50mA.
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
165
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