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GRM2195C1H562JA01D 参数 Datasheet PDF下载

GRM2195C1H562JA01D图片预览
型号: GRM2195C1H562JA01D
PDF下载: 下载PDF文件 查看货源
内容描述: 片状独石陶瓷电容器 [Chip Monolithic Ceramic Capacitors]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 221 页 / 4341 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
C02E.pdf  
!Note  
sales representatives or product engineers before ordering.  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
10.12.20  
GJM Series Specifications and Test Methods  
Continued from the preceding page.  
Specifications  
No.  
Item  
Test Method  
Temperature Compensating Type  
No defects or abnormalities  
Appearance  
Capacitance  
Solder the capacitor to the test jig (glass epoxy board) in the  
same manner and under the same conditions as (10).  
The capacitor should be subjected to a simple harmonic motion  
having a total amplitude of 1.5mm, the frequency being varied  
uniformly between the approximate limits of 10 and 55Hz.  
The frequency range, from 10 to 55Hz and return to 10Hz,  
should be traversed in approximately 1 minute. This motion  
should be applied for a period of 2 hours in each of 3 mutually  
perpendicular directions (total of 6 hours).  
Within the specified tolerance  
Vibration  
Resistance  
11  
30pF and over: QU1000  
30pF and below: QU400W20C  
C: Nominal Capacitance (pF)  
Q
Appearance  
No marking defects  
Solder the capacitor to the test jig (glass epoxy boards) shown  
in Fig. 2 using a eutectic solder.  
Then apply a force in the direction shown in Fig. 3.  
The soldering should be done by the reflow method and should  
be conducted with care so that the soldering is uniform and free  
Capacitance  
Change  
Within T5% or T0.5pF  
(whichever is larger)  
of defects such as heat shock  
.
b
φ4.5  
20  
Pressurizing  
50  
speed: 1.0mm/sec.  
Pressurize  
c
12 Deflection  
R230  
a
t: 0.8mm  
100  
Type  
a
b
c
Flexure : V1  
GJ M03  
GJ M15  
0.3  
0.4  
0.9  
1.5  
0.3  
0.5  
Capacitance meter  
45 45  
(in mm)  
(in mm)  
Fig. 2  
Fig. 3  
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and  
rosin (JIS-K-5902) (25% rosin in weight proportion).  
Preheat at 80 to 120D for 10 to 30 seconds. After preheating,  
immerse in eutectic solder solution for 2T0.5 seconds at 230T5D  
or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5°C.  
Solderability of  
Termination  
75% of the terminations are to be soldered evenly and  
continuously.  
13  
The measured and observed characteristics should satisfy the  
specifications in the following table.  
Appearance  
No marking defects  
Capacitance  
Change  
Within T2.5% or T0.25pF  
(whichever is larger)  
Preheat the capacitor at 120 to 150D for 1 minute.  
Immerse the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu  
solder solution at 270T5D for 10T0.5 seconds.  
Let sit at room temperature for 24T2 hours.  
Resistance  
14 to Soldering  
Heat  
30pF and over: QU1000  
30pF and below: QU400W20C  
C: Nominal Capacitance (pF)  
Q
I.R.  
More than 10,000Mor 500· F (whichever is smaller)  
Dielectric  
Strength  
No failure  
The measured and observed characteristics should satisfy the  
specifications in the following table.  
Fix the capacitor to the supporting jig in the same manner and  
under the same conditions as (10). Perform the five cycles  
according to the four heat treatments listed in the following table.  
Let sit for 24T2 hours at room temperature, then measure.  
Appearance  
No marking defects  
Capacitance  
Change  
Within T2.5% or T0.25pF  
(whichever is larger)  
Temperature  
15  
30pF and over: QU1000  
30pF and below: QU400W20C  
C: Nominal Capacitance (pF)  
Step  
1
2
3
4
Cycle  
Q
Min. Operating  
Temp.W0/Y3  
Max. Operating  
Temp.W3/Y0  
Room  
Temp.  
Room  
Temp.  
Temp. (D)  
30T3  
30T3  
Time (min.)  
2 to 3  
2 to 3  
I.R.  
More than 10,000Mor 500· F (whichever is smaller)  
Dielectric  
Strength  
No failure  
The measured and observed characteristics should satisfy the  
specifications in the following table.  
Appearance  
No marking defects  
Capacitance  
Change  
Within T5% or T0.5pF  
(whichever is larger)  
Let the capacitor sit at 40T2D and 90 to 95% humidity for  
500T12 hours.  
Remove and let sit for 24T2 hours (temperature compensating  
type) at room temperature, then measure.  
Humidity,  
16 Steady  
State  
30pF and below:  
10pF and over, 30pF and below: QU275W  
10pF and below:  
QU350  
5
2
C
Q
QU200W10C  
C: Nominal Capacitance (pF)  
I.R.  
More than 10,000Mor 500· F (whichever is smaller)  
Continued on the following page.  
98