Substrate Bending test
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ: Solder resist
(Coat with heat resistant resin for solder)
b
Land
Dimension (mm)
f4.5
Type
a
b
c
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
0.2
0.3
0.4
1.0
1.2
2.2
2.2
0.56
0.9
1.5
3.0
4.0
5.0
5.0
0.23
0.3
0.5
1.2
1.65
2.0
2.9
a
100
Fig.1
Kind of Solder : Sn-3.0Ag-0.5Cu
Pressurization method
(in mm)
20
・
・
Pressurization
speed
1.0mm/s
50 min.
Pressurize
R5
Flexure
Capacitance meter
45 45
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
Kind of Solder : Sn-3.0Ag-0.5Cu
Land Dimensions
・
・
Chip Capacitor
Dimension (mm)
Type
Land
a
b
c
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
0.2
0.3
0.4
1.0
1.2
2.2
2.2
0.56
0.9
1.5
3.0
4.0
5.0
5.0
0.23
0.3
0.5
1.2
1.65
2.0
2.9
a
Solder Resist
b
Fig.3
JEMCGS-0001U
5
MURATA [ muRata ]
