Table A
Char.
Capacitance Change from Value at Reference temp. (%)
-30 -25℃
-55℃
-10℃
Max.
0.54
0.82
1.37
2.56
0.58
0.87
Min.
-0.23
-0.45
-0.90
-1.88
-0.24
-0.48
Max.
-
-
-
-
Min.
-
-
-
Max.
0.33
0.49
0.82
1.54
-
Min.
-0.14
-0.27
-0.54
-1.13
-
Max.
0.22
0.33
0.55
1.02
0.25
0.38
Min.
-0.09
-0.18
-0.36
-0.75
-0.11
-0.21
1C
2C
3C
4C
5C
6C
-
0.40
0.59
-0.17
-0.33
-
-
Substrate Bending test
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness :0.8mm
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ: Solder resist
(Coat with heat resistant resin for solder)
for GJM02
for GJM03/15
Land
b
a
f4.5
Dimension (mm)
Type
a
b
c
100
ꢀ
Copper foil thickness : 0.018mm
ꢀCopper foil thickness : 0.035mm
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀFig.1
(in mm)
Kind of Solder : Sn-3.0Ag-0.5Cu
Pressurization method
・
・
Pressurization
speed
1.0mm/s
Pressurize
50 min.
20
R5
Flexure
Capacitance meter
45 45
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
Kind of Solder : Sn-3.0Ag-0.5Cu
Land Dimensions
・
・
Chip Capacitor
Land
Type
a
b
c
a
Solder Resist
b
Fig.3
JEMCGS-0004M
4
MURATA [ muRata ]
