■ Specifications and Test Methods
No Item
15 Solderability (a)
Specification
Test Method（Ref. Standard:AEC-Q200）
Perform a heat treatment at 155°C for 4hours.
95% of the terminations is to be soldered evenly and continuously.
Pre-treatment
Flux
Solution of rosin ethanol 25(mass)%
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Sn-3.0Ag-0.5Cu solder solution at 245+/-5 ℃
5+0/-0.5s
Kind of Solder
Solder Temperature
Immersion time
Immersion and emersion rate
25+/-5mm/s
Measurement Temperature
Shown in Rated value.
25℃
16 Capacitance
Measurement Frequency 1.0+/-0.1MHz
Measurement Voltage
0.5 to 5.0Vrms
Measurement Temperature
Q≧400+20C C:Nominal Capacitance(pF)
More than 10000MΩ
25℃
17 Q or Dissipation Factor
(D.F.)
Measurement Frequency 1.0+/-0.1MHz
Measurement Voltage
0.5 to 5.0Vrms
Measurement Temperature
Measurement Voltage
Charging Time
25℃
Rated Voltage
1min
18 Insulation
Resistance(I.R.)
(Room Temperature)
Charge/discharge current 50mA max.
Measurement Temperature
Measurement Voltage
Charging Time
More than 1000MΩ
125℃
Rated Voltage
1min
19 Insulation
Resistance(I.R.)
(High Temperature)
Charge/discharge current 50mA max.
No defects or abnormalities.
Test Voltage
Applied Time
Charge/discharge current 50mA max.
250% of the rated voltage
1s to 5s
20 Voltage proof
21 Board Flex
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-0.5pF
Within the specified initial value.
Within the specified initial value.
Mounting method
Pressurization Method
Flexure
Reflow solder the capacitor on the test substrate
Shown in Fig.2
2mm
I.R.(Room Temp.)
Holding Time
60s
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Mounting method
Applied Force
Holding Time
Solder the capacitor on the test substrate
2N
60s
22 Terminal Strength
23 Beam Load Test
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
I.R.(Room Temp.)
Speed supplied the Stress Load
Destruction Value: More than 8N
0.5mm/s
Placement diagram
GCQ1555C1H6R6WB01-01A
4
MURATA [ muRata ]
