Table A Capacitance Change between at Reference Temp. and at each Temp. (%)
-55℃
-30℃
-10℃
Char.
7U
Max.
8.78
Min.
5.04
Max.
6.04
Min.
3.47
Max.
3.84
Min.
2.21
Board Flex
・Test substrate
Material
Except for Board Flex
・Test substrate
Material
Glass epoxy PCB
1.6mm
Glass epoxy PCB
1.6mm
Thickness
Thickness
・Land Dimension
・Land Dimension
Dimension(mm)
Dimension(mm)
b c
Type
Type
a
a
b
c
GCM31
2.0
4.4
1.7
GCM31
2.2
5.0
2.0
・Pressurization Method
GCM31A7U2J122JX01-00B
6