■ Specifications and Test Methods
No Item
15 Solderability (a)
Specification
Test Method（Ref. Standard:AEC-Q200）
Perform a heat treatment at 155°C for 4hours.
95% of the terminations is to be soldered evenly and continuously.
Pre-treatment
Flux
Solution of rosin ethanol 25(mass)%
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Sn-3.0Ag-0.5Cu solder solution at 245+/-5 ℃
5+0/-0.5s
Kind of Solder
Solder Temperature
Immersion time
Immersion and emersion rate
25+/-2.5mm/s
Measurement Temperature
Shown in Rated value.
Q≧1000
25℃
16 Capacitance
Measurement Frequency 1.0+/-0.1kHz
Measurement Voltage
1.0+/-0.2Vrms
Measurement Temperature
25℃
17 Q or Dissipation Factor
(D.F.)
Measurement Frequency 1.0+/-0.1kHz
Measurement Voltage
1.0+/-0.2Vrms
Measurement Temperature
Measurement Voltage
Charging Time
More than 100000MΩ
25℃
DC500+/-50V
1min
18 Insulation
Resistance(I.R.)
(Room Temperature)
Charge/discharge current 50mA max.
Measurement Temperature
Measurement Voltage
Charging Time
More than 10000MΩ
125℃
DC500+/-50V
1min
19 Insulation
Resistance(I.R.)
(High Temperature)
Charge/discharge current 50mA max.
No defects or abnormalities.
Test Voltage
Applied Time
Charge/discharge current 50mA max.
150% of the rated voltage
1s to 5s
20 Voltage proof
21 Board Flex
Appearance
No defects or abnormalities.
Within +/-5%
Mounting method
Pressurization Method
Flexure
Reflow solder the capacitor on the test substrate
Shown in Fig.2
3mm
Capacitance Change
Holding Time
60s
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ
Mounting method
Applied Force
Holding Time
Reflow solder the capacitor on the test substrate
18N
60s
22 Terminal Strength
23 Beam Load Test
I.R.(Room Temp.)
Speed supplied the Stress Load
Destruction Value: More than 15N
2.5mm/s
Placement diagram
GCM31A7U2J122JX01-00B
4
MURATA [ muRata ]
