■ Specifications and Test Methods
No Item
Specification
Test Method（Ref. Standard:AEC-Q200）
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
More than 500Ω・F
Per MIL-STD-202 Method 215
10 Resistance to Solvents
I.R.(Room Temp.)
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
More than 500Ω・F
Mounting method
Waveform
Peak value
Solder the capacitor on the test substrate
Half-sine
1500g
11 Mechanical Shock
I.R.(Room Temp.)
Holding Time
0.5ms
Velocity change
Shocks directions and times
4.7m/s
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
More than 500Ω・F
Mounting method
Kind of Vibration
Vibration Time
Solder the capacitor on the test substrate
A 10Hz to 2000Hz to 10Hz
20min
1.5mm
12 Vibration
I.R.(Room Temp.)
Total amplitude
Vibration directions and time
This motion should be applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
Appearance
Capacitance or Capacitance Change
No defects or abnormalities.
Pre-treatment
Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours
at room temperature, then measure.
Solder bath method
Sn-3.0Ag-0.5Cu(Lead Free Solder)
260+/-5℃
10+/-1s
13 Resistance to Soldering
Heat
Capacitance:Within the specified initial value.
Within the specified initial value.
More than 500Ω・F
Q or D.F.
I.R.(Room Temp.)
Test Method
Kind of Solder
Test Temperature
Test Time
Post-treatment
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
More than 500Ω・F
Per AEC-Q200-002
Post-treatment
14 ESD
Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours
at room temperature, then measure.
I.R.(Room Temp.)
95% of the terminations is to be soldered evenly and continuously.
Pre-treatment
Flux
Kind of Solder
Solder Temperature
Immersion time
Immersion and emersion rate
Perform a heat treatment at 155°C for 4hours.
Solution of rosin ethanol 25(mass)%
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Sn-3.0Ag-0.5Cu solder solution at 245+/-5 ℃
5+0/-0.5s
15 Solderability (a)
25+/-5mm/s
Measurement Temperature
Shown in Rated value.
25℃
16 Capacitance
Measurement Frequency 1.0+/-0.1kHz
Measurement Voltage
1.0+/-0.2Vrms
Measurement Temperature
DF≦0.025
25℃
17 Q or Dissipation Factor
(D.F.)
Measurement Frequency 1.0+/-0.1kHz
Measurement Voltage
1.0+/-0.2Vrms
GCM21BR71H184JA37-01A
4
MURATA [ muRata ]
