MP6922—DUAL FAST TURN-OFF INTELLIGENT CONTROLLER
ORDERING INFORMATION
Part Number
MP6922DN*
MP6922DS**
MP6922DSE***
Package
SOIC8E
SOIC14
SOIC8
Top Marking
MP6922
MP6922
MP6922
*For Tape & Reel, add suffix –Z (e.g. MP6922DN–Z);
For RoHS Compliant Packaging, add suffix –LF; (e.g. MP6922DN–LF–Z)
**For Tape & Reel, add suffix –Z (e.g. MP6922DS–Z);
For RoHS Compliant Packaging, add suffix –LF; (e.g. MP6922DS–LF–Z)
***For Tape & Reel, add suffix –Z (e.g. MP6922DSE–Z);
For RoHS Compliant Packaging, add suffix –LF; (e.g. MP6922DSE–LF–Z)
PACKAGE REFERENCE
TOP VIEW
TOP VIEW
TOP VIEW
VG2
VG1
VDD
VD1
1
8
14
13
PGND
VG1
PGND
VG2
1
2
VG2
VG1
1
8
MP6922
SOIC-8E
EN
VD2
7
6
5
2
3
4
MP6922
SOIC-14
MP6922
SOIC-8
12 VDD
EN
LL
3
4
5
6
VDD
PGND
2
3
4
7
6
5
11 RCP
10 NC
EN
VD2
VD1
NC
VD2
VS2
S1
V
S2
V
S1
9
8
VD1
VS1
D1
VSS
PGND
EXPOSED PAD
(SOIC8 N ONLY)
7
SOIC8
SOIC8E
SOIC14
ABSOLUTE MAXIMUM RATINGS (1)
VDD to VS1,VS2, VSS ........................-0.3V to +26V
PGND to VS1,VS2, VSS...................-0.3V to +0.3V
VG1 to VS1, VSS................................. -0.3V to VDD
VG2 to VS2, VSS................................. -0.3V to VDD
VD1 to VS1, VSS .............................-0.7V to +180V
Recommended Operation Conditions (3)
VDD to VS1,VS2, VSS...............................8V to 24V
Operating Junction Temp. (TJ).... -40°C to +125°C
Thermal Resistance (4)
θJA
θJC
SOIC8 .....................................90 ...... 45...°C/W
SOIC8E...................................50 ...... 10...°C/W
SOIC14 ...................................86 ...... 38...°C/W
VD2 to VS2, VSS .............................-0.7V to +180V
LL, EN to VS1,VS2, VSS ..................-0.3V to +6.5V
Maximum Operating Frequency............ 300 kHz
Notes:
(2)
1) Exceeding these ratings may damage the device.
2) TA=+25℃. The maximum allowable power dissipation is a
function of the maximum junction temperature TJ (MAX), the
junction-to-ambient thermal resistance θJA, and the ambient
temperature TA. The maximum allowable continuous power
dissipation at any ambient temperature is calculated by PD
(MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable
power dissipation will cause excessive die temperature, and
the regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
Continuous Power Dissipation.. (TA = +25°C)
SOIC8E...................................................... 2.5W
SOIC14...................................................... 1.5W
SOIC8........................................................ 1.4W
Junction Temperature...............................150°C
Lead Temperature (Solder).......................260°C
Storage Temperature .............. -55°C to +150°C
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB. Without heatsink.
MP6922 Rev. 1.23
9/19/2012
www.MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2012 MPS. All Rights Reserved.
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