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XPC860PCZP50D3 参数 Datasheet PDF下载

XPC860PCZP50D3图片预览
型号: XPC860PCZP50D3
PDF下载: 下载PDF文件 查看货源
内容描述: 系列硬件规格 [Family Hardware Specifications]
分类和应用:
文件页数/大小: 76 页 / 805 K
品牌: MOTOROLA [ MOTOROLA ]
 浏览型号XPC860PCZP50D3的Datasheet PDF文件第7页浏览型号XPC860PCZP50D3的Datasheet PDF文件第8页浏览型号XPC860PCZP50D3的Datasheet PDF文件第9页浏览型号XPC860PCZP50D3的Datasheet PDF文件第10页浏览型号XPC860PCZP50D3的Datasheet PDF文件第12页浏览型号XPC860PCZP50D3的Datasheet PDF文件第13页浏览型号XPC860PCZP50D3的Datasheet PDF文件第14页浏览型号XPC860PCZP50D3的Datasheet PDF文件第15页  
Estimation with Junction-to-Board Thermal Resistance  
where:  
RθJA = junction-to-ambient thermal resistance (ºC/W)  
RθJC = junction-to-case thermal resistance (ºC/W)  
RθCA = case-to-ambient thermal resistance (ºC/W)  
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal  
environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user  
can change the air flow around the device, add a heat sink, change the mounting  
arrangement on the printed circuit board, or change the thermal dissipation on the printed  
circuit board surrounding the device. This thermal model is most useful for ceramic  
packages with heat sinks where some 90% of the heat flows through the case and the heat  
sink to the ambient environment. For most packages, a better model is required.  
7.3 Estimation with Junction-to-Board Thermal  
Resistance  
A simple package thermal model which has demonstrated reasonable accuracy (about 20%)  
is a two resistor model consisting of a junction-to-board and a junction-to-case thermal  
resistance. The junction-to-case covers the situation where a heat sink is used or where a  
substantial amount of heat is dissipated from the top of the package. The junction-to-board  
thermal resistance describes the thermal performance when most of the heat is conducted  
to the printed circuit board. It has been observed that the thermal performance of most  
plastic packages and especially PBGA packages is strongly dependent on the board  
temperature; see Figure 7-1.  
100  
9 0  
8 0  
7 0  
6 0  
5 0  
4 0  
3 0  
2 0  
1 0  
0
0
2 0  
4 0  
6 0  
8 0  
Board Temperature Rise Above Ambient Divided by Package Power  
Figure 7-1. Effect of Board Temperature Rise on Thermal Behavior  
MOTOROLA  
MPC860 Family Hardware Specifications  
11