Thermal Characteristics
Table 3-2. Maximum Tolerated Ratings
(GND = 0 V)
Rating
Supply Voltage
1
Symbol
V
DDH
V
DDL
KAPWR
VDDSYN
Value
–0.3 to 4.0
–0.3 to 4.0
–0.3 to 4.0
–0.3 to 4.0
GND – 0.3 to VDDH
0
95
–40
95
–55 to 150
Unit
V
V
V
V
V
˚C
˚C
˚C
˚C
˚C
Input Voltage
2
Temperature
3
(Standard)
V
in
T
A(min)
T
j(max)
Temperature
3
(Extended)
T
A(min)
T
j(max)
Storage Temperature Range
1
2
T
stg
The power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution
: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies
to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be
applied to its inputs).
3
Minimum temperatures are guaranteed as ambient temperature, T . Maximum temperatures are guaranteed as
A
junction temperature, T
j
.
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC860.
Table 4-3. MPC860 Thermal Resistance Data
Rating
Junction to Ambient
1
Environment
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Air Flow (200 ft/min)
Single layer board (1s)
Four layer board (2s2p)
Junction to Board
4
Junction to Case
5
Junction to Package Top Natural Convection
6
Symbol
R
θ
JA 2
R
θ
JMA 3
R
θ
JMA3
R
θ
JMA3
R
θ
JB
R
θ
JC
Ψ
JT
Rev A
31
20
26
16
8
5
1
2
Rev
B, C, D
40
25
32
21
15
7
2
3
Unit
°C/W
Air Flow (200 ft/min)
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
MOTOROLA
MPC860 Family Hardware Specifications
7
MOTOROLA [ MOTOROLA, INC ]
