PACKAGE DIMENSIONS
PLASTIC DIP
P SUFFIX
CASE 646-06
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION
AT SEATING PLANE AT MAXIMUM MATERIAL
CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED
PARALLEL.
14
1
8
B
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
4. ROUNDED CORNERS OPTIONAL.
7
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
MAX
MIN
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
0.770
0.260
0.185
0.021
0.070
18.16
6.10
3.69
0.38
1.02
L
C
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
10
0.039
7.62 BSC
10
0.39 1.01
SEATING
K
0°
°
0°
°
0.015
H
G
D PLANE
M
MC145053
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS DEVICE DATA
14
MOTOROLA [ MOTOROLA ]
