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V54C316162V-55 参数 Datasheet PDF下载

V54C316162V-55图片预览
型号: V54C316162V-55
PDF下载: 下载PDF文件 查看货源
内容描述: 200/183/166/143 MHz的3.3伏, 4K刷新超高性能1M ×16 SDRAM 2组X达512Kbit ×16 [200/183/166/143 MHz 3.3 VOLT, 4K REFRESH ULTRA HIGH PERFORMANCE 1M X 16 SDRAM 2 BANKS X 512Kbit X 16]
分类和应用: 内存集成电路光电二极管动态存储器
文件页数/大小: 21 页 / 306 K
品牌: MOSEL [ MOSEL VITELIC, CORP ]
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V54C316162V  
The chip enters the Auto Refresh mode, when  
RAS and CAS are held low and CKE and WE are  
held high at a clock timing. The mode restores word  
line after the refresh and no external precharge  
command is necessary. A minimum tRC time is re-  
quired between two automatic refreshes in a burst  
refresh mode. The same rule applies to any access  
command after the automatic refresh operation.  
The chip has an on-chip timer and the Self Re-  
fresh mode is available. It enters the mode when  
RAS, CAS, and CKE are low and WE is high at a  
clock timing. All of external control signals including  
the clock are disabled. Returning CKE to high en-  
ables the clock and initiates the refresh exit opera-  
Auto Precharge  
Two methods are available to precharge  
SDRAMs. In an automatic precharge mode, the  
CAS timing accepts one extra address, A , to de-  
termine whether the chip restores or not after the  
10  
operation. If A is high when a Read Command is  
10  
issued, the Read with Auto-Precharge function is  
initiated. The SDRAM automatically enters the pre-  
charge operation one clock before the last data out  
for CAS latencies 2, two clocks for CAS latencies 3.  
If A is high when a Write Command is issued, the  
10  
Write with Auto-Precharge function is initiated.  
The SDRAM automatically enters the precharge op-  
eration a time delay equal to t  
time) after the last data in.  
(Write recovery  
WR  
tion. After the exit command, at least one t delay  
RC  
is required prior to any access command.  
Precharge Command  
There is also a separate precharge command  
available. When RAS and WE are low and CAS is  
high at a clock timing, it triggers the precharge op-  
DQM Function  
DQM has two functions for data I/O read and  
write operations. During reads, when it turns to  
highat a clock timing, data outputs are disabled  
and become high impedance after two clock delay  
eration. With A being low, the BA is used select  
10  
bank to precharge. The precharge command can be  
imposed one clock before the last data out for CAS  
latency = 2, two clocks before the last data out for  
CAS latency = 3. Writes require a time delay twr  
from the last data out to apply the precharge com-  
(DQM Data Disable Latency t  
a data mask function for writes. When DQM is acti-  
vated, the write operation at the next clock is prohib-  
). It also provides  
DQZ  
ited (DQM Write Mask Latency t  
= zero clocks).  
DQW  
DQM is used for device selection, byte selection  
and bus control in a memory system. LDQM con-  
trols DQ0 to DQ7, UDQM controls DQ8 to DQ15.  
mand. If A is high, all banks will be precharged.  
10  
Burst Termination  
Once a burst read or write operation has been ini-  
tiated, there are several methods in which to termi-  
nate the burst operation prematurely. These  
methods include using another Read or Write Com-  
mand to interrupt an existing burst operation, use a  
Precharge Command to interrupt a burst cycle and  
close the active bank, or using the Burst Stop Com-  
mand to terminate the existing burst operation but  
leave the bank open for future Read or Write Com-  
mands to the same page of the active bank. When  
interrupting a burst with another Read or Write  
Command care must be taken to avoid I/O conten-  
tion. The Burst Stop Command, however, has the  
fewest restrictions making it the easiest method to  
use when terminating a burst operation before it has  
been completed. If a Burst Stop command is issued  
during a burst write operation, then any residual  
data from the burst write cycle will be ignored. Data  
that is presented on the I/O pins before the Burst  
Stop Command is registered will be written to the  
memory.  
Suspend Mode  
During normal access mode, CKE is held high en-  
abling the clock. When CKE is low, it freezes the in-  
ternal clock and extends data read and write  
operations. One clock delay is required for mode  
entry and exit (Clock Suspend Latency t  
).  
CSL  
Power Down  
In order to reduce standby power consumption, a  
power down mode is available. All banks must be  
precharged and the necessary Precharge delay  
(trp) must occur before the SDRAM can enter the  
Power Down mode. Once the Power Down mode is  
initiated by holding CKE low, all of the receiver cir-  
cuits except CLK and CKE are gated off. The Power  
Down mode does not perform any refresh opera-  
tions, therefore the device cant remain in Power  
Down mode longer than the Refresh period (tref) of  
the device. Exit from this mode is performed by tak-  
ing CKE high. One clock delay is required for  
mode entry and exit.  
V54C316162V Rev. 2.9 September 2001  
7
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