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V53C16258HT40 参数 Datasheet PDF下载

V53C16258HT40图片预览
型号: V53C16258HT40
PDF下载: 下载PDF文件 查看货源
内容描述: 高性能256K ×16 EDO页模式的CMOS动态RAM可选自刷新 [HIGH PERFORMANCE 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH]
分类和应用: 内存集成电路光电二极管动态存储器
文件页数/大小: 20 页 / 560 K
品牌: MOSEL [ MOSEL VITELIC, CORP ]
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MO SEL VITELIC  
V53C16258H  
Functional Description  
Extended Data Output Page Mode  
The V53C16258H is a CMOS dynamic RAM  
optimized for high data bandwidth, low power  
applications. It is functionally similar to a traditional  
dynamic RAM. The V53C16258H reads and writes  
data by multiplexing an 18-bit address into a 9-bit  
row and a 9-bit column address. The row address is  
latched by the Row Address Strobe (RAS). The  
column address “flows through” an internal address  
buffer and is latched by the Column Address Strobe  
(CAS). Because access time is primarily dependent  
on a valid column address rather than the precise  
time that the CAS edge occurs, the delay time from  
RAS to CAS has little effect on the access time.  
EDO Page operation permits all 512 columns  
within a selected row of the device to be randomly  
accessed at a high data rate. Maintaining RAS low  
while performing successive CAS cycles retains the  
row address internally and eliminates the need to  
reapply it for each cycle. The column address buffer  
acts as a transparent or flow-through latch while  
CAS is high. Thus, access begins from the  
occurrence of a valid column address rather than  
from the falling edge of CAS, eliminating t  
and t  
ASC  
T
from the critical timing path. CAS latches the  
address into the column address buffer. During  
EDO operation, Read, Write, Read-Modify-Write or  
Read-Write-Read cycles are possible at random  
addresses within a row. Following the initial entry  
Memory Cycle  
A memory cycle is initiated by bringing RAS low.  
Any memory cycle, once initiated, must not be  
cycle into Hyper Page Mode, access is t  
or t  
CAA  
CAP  
controlled. If the column address is valid prior to the  
rising edge of CAS, the access time is referenced to  
the CAS rising edge and is specified by t  
ended or aborted before the minimum t  
time has  
RAS  
expired. This ensures proper device operation and  
data integrity. A new cycle must not be initiated until  
. If the  
CAP  
column address is valid after the rising CAS edge,  
access is timed from the occurrence of a valid  
the minimum precharge time t /t has elapsed.  
RP CP  
address and is specified by t  
. In both cases, the  
CAA  
Read Cycle  
falling edge of CAS latches the address and  
enables the output.  
A Read cycle is performed by holding the Write  
Enable (WE) signal High during a RAS/CAS  
operation. The column address must be held for a  
EDO provides a sustained data rate of 83 MHz for  
applications that require high bandwidth such as bit-  
mapped graphics or high-speed signal processing.  
The following equation can be used to calculate the  
maximum data rate:  
minimum specified by t . Data Out becomes valid  
only when t  
satisifed. As a result, the access time is dependent  
on the timing relationships between these  
parameters. For example, the access time is limited  
AR  
, t  
, t  
and t  
are all  
OAC  
RAC  
CAA  
CAC  
512  
by t  
when t  
, t  
and t  
are all satisfied.  
CAA  
RAC CAC  
OAC  
Data Rate = ----------------------------------------  
t
+ 511 × t  
RC  
PC  
Write Cycle  
A Write Cycle is performed by taking WE and  
CAS low during a RAS operation. The column  
address is latched by CAS. The Write Cycle can be  
WE controlled or CAS controlled depending on  
whether WE or CAS falls later. Consequently, the  
input data must be valid at or before the falling edge  
of WE or CAS, whichever occurs last. In the CAS-  
controlled Write Cycle, when the leading edge of  
WE occurs prior to the CAS low transition, the I/O  
data pins will be in the High-Z state at the beginning  
of the Write function. Ending the Write with RAS or  
CAS will maintain the output in the High-Z state.  
In the WE controlled Write Cycle, OE must be in  
Self Refresh  
Self Refresh mode provides internal refresh con-  
trol signals to the DRAM during extended periods of  
inactivity. Device operation in this mode provides  
additional power savings and design ease by elimi-  
nation of external refresh control signals. Self Re-  
fresh mode is initiated with a CAS before RAS  
(CBR) Refresh cycle, holding both RAS low (t  
and CAS low (t  
)
RASS  
) for a specified period. Both of  
CHD  
these parameters are specified with minimum val-  
ues to guarantee entry into Self Refresh operation.  
Once the device has been placed in to Self Refresh  
mode the CAS clock is no longer required to main-  
tain Self Refresh operation.  
the high state and t  
must be satisfied.  
OED  
V53C16258H Rev. 3.8 November 1999  
16  
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