<IGBT Modules>
CM100MXUB-13T/CM100MXUBP-13T
HIGH POWER SWITCHING USE
INSULATED TYPE
MECHANICAL CHARACTERISTICS
Symbol
M
s
Mounting torque
Item
Mounting to heat sink
Solder pin type(MXUB)
d
s
Creepage distance
Pressfit pin type(MXUBP)
Solder pin type(MXUB)
d
a
Clearance
Pressfit pin type(MXUBP)
e
c
m
Flatness of base plate
mass
On the centerline X, Y
-
(Note9)
Conditions
M 5 screw
Terminal to terminal
Terminal to base plate
Terminal to terminal
Terminal to base plate
Terminal to terminal
Terminal to base plate
Terminal to terminal
Terminal to base plate
Limits
Min.
2.5
10.9
18.3
5.2
16.1
6.5
13.1
5.0
16.1
±0
-
Typ.
3.0
-
-
-
-
-
-
-
-
-
165
Max.
3.5
-
-
-
-
-
-
-
-
+200
-
Unit
N·m
mm
μm
g
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
GEon
R
G
Item
(DC) Supply voltage
Gate (-emitter drive) voltage
External gate resistance
Conditions
Applied across P-N(P1-N1) terminals
Applied across
G*P-*/G*N-E/GB-E terminals (*=U,V,W)
Inverter IGBT, Per switch
Brake IGBT
Limits
Min.
-
13.5
6.2
8.2
Typ.
300
15.0
-
-
Max.
450
16.5
62
82
Unit
V
V
Ω
*: This product is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) directive 2011/65/EU.
Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free-wheeling diode (FWD).
2. Junction temperature (T
v j
) should not increase beyond T
v j m a x
rating.
3. Pulse width and repetition rate should be such that the device junction temperature (T
v j
) dose not exceed T
v j m a x
rating.
4. Case temperature (T
C
) and heat sink temperature (T
S
) are defined on the each surface (mounting side) of base plate and heat sink just under the chips.
Refer to the figure of chip location.
5. Pulse width and repetition rate should be such as to cause negligible temperature rise. Refer to the figure of test circuit.
R
25
1
1
)
−
) /(
6.
B
(
25
/
50
)
=
ln(
R
50
T
25
T
50
R
25
: resistance at absolute temperature T
25
[K]; T
25
=25 [°C]+273.15=298.15 [K]
R
50
: resistance at absolute temperature T
50
[K]; T
50
=50 [°C]+273.15=323.15 [K]
7. Typical value is measured by using thermally conductive grease of
λ=0.9
W/(m·K)/D
(C-S)
=50
μm.
8. Typical value is measured by using PC-TIM of
λ=3.4
W/(m·K)/D
(C-S)
=50
μm.
9. The base plate (mounting side) flatness measurement points (X, Y) are shown in the following figure.
-:Concave
mounting side
+:Convex
-:Concave
+:Convex
Y
X
mounting side
2mm
mounting side
2mm
10. Use the following screws when mounting the printed circuit board (PCB) on the standoffs.
PCB thickness : t1.6
Type
(1)
(2)
(3)
(4)
(5)
PT
PT
DELTA PT
DELTA PT
B1
tapping screw
-
Manufacturer
EJOT
Size
K25×8
K25×10
25×8
25×10
φ2.6×10
φ2.6×12
Tightening torque
(N
・
m)
0.55 ± 0.055
0.75 ± 0.075 N
・
m
0.55 ± 0.055 N・m
0.75 ± 0.075 N・m
0.75 ± 0.075 N・m
by handwork (equivalent to 30 rpm
by mechanical screw driver)
~ 600 rpm (by mechanical screw driver)
Recommended tightening method
Publication Date : June 2018
CMH-11882
7
Ver.1.0
MITSUBISHI [ MITSUBISHI ELECTRIC SEMICONDUCTOR ]
