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PDSP16488GC 参数 Datasheet PDF下载

PDSP16488GC图片预览
型号: PDSP16488GC
PDF下载: 下载PDF文件 查看货源
内容描述: 单芯片的二维卷积器与积分行延迟 [Single Chip 2D Convolver with Integral Line Delays]
分类和应用:
文件页数/大小: 33 页 / 414 K
品牌: MITEL [ MITEL NETWORKS CORPORATION ]
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ELECTRICAL CHARACTERISTICS  
The Electrical Characteristics are guaranteed over the following range of operating conditions, unless otherwise stated:  
VDD = 15V±10%, GND = 0V, TAMB (Commercial) = 0°C to170°C, TAMB (Industrial) = 240°C to 185°C,  
TAMB (Military) = 255°C to 1125°C  
Static Characteristics  
Characteristic  
Value  
Min. Typ. Max.  
Symbol  
Conditions  
Units  
VOH  
VOL  
VIH  
VIL  
IIN  
CIN  
IOZ  
IOS  
ISP  
Output high voltage  
Output low voltage  
Input high voltage  
Input low voltage  
Input leakage current  
Input capacitance  
Output leakage current  
Output short circuit current  
Current at full speed  
2·4  
-
2·0  
-
-
V
V
V
IOH = 4mA  
IOL = 28mA  
0·4  
-
0·8  
110  
V
210  
µA  
pF  
µA  
mA  
mA  
GND < VIN < VDD, no internal pullup  
10  
250  
10  
150  
300  
Max.  
GND < VOUT < VDD, no internal pullup  
VDD = 15·5V  
NOTE: Signal pins PC0, X15, MASTER, SINGLE and OVR have pullup resistors in the range 15kWto 200kW. BYPASS, PROG and DS have no internal pullup  
resistors. When the device is used in EPROM mode, external pullup resistors should be connected to the PROG and DS pins.  
PDSP16488A MA ACBR and PDSP16488A MA GCPR  
ABSOLUTE MAXIMUM RATINGS (NOTE 1)  
(MIL-STD-883 CLASS B PARTS)  
Supply voltage, VDD  
Input voltage, VIN  
Output voltage, VOUT  
20·5V to17·0V  
20·5V to VDD 10·5V  
20·5V to VDD 10·5V  
Polyimide is used as an inter-layer dielectric and as  
glassification. Polymeric material is also used for die attach  
which, according to the requirements in paragraph 1.2.1, pre-  
cludes categorising these devices as fully compliant. In every  
other respect, these devices are manufactured and screened in  
full accordance with MIL-STD-883 (latest revision).  
The PDSP16488A MA ACBR (PGA packge) is subject to the  
constant acceleration test, Method 2001, Test Condition A (5kg).  
Life test/burn-in connections are given in Tables 12 and 13 on  
the following page.  
18mA  
500V  
Clamp diode current per pin, IK (see note 2)  
Static discharge voltage (HBM)  
Storage temperature, TS  
Maximum junction temperature, TJMAX  
Commercial grade  
265°C to1150°C  
195°C  
1110°C  
1150°C  
2000mW  
5°C/W  
Industrial grade  
Military grade  
Package power dissipation  
Thermal resistance, junction-to-case, qJC  
Change Notification  
The change notification requirements of MIL-PRF-38535  
will be implemented on MIL-STD-883 grade devices. Known  
customers will be notified of any changes since the last buy  
when ordering further parts if significant changes have been  
made.  
NOTES  
1. Exceeding these ratings may cause permanent damage.  
Functional operation under these conditions is not implied.  
2. Maximum dissipation should not be exceeded for more  
than1 second, only one output to be tested at any one time.  
3. Exposure to absolute maximum ratings for extended  
periods may affect device reliablity.  
Rev.  
Date  
A
B
C
D
MAR 1993 JUL 1996 NOV 1997  
4. Current is defined as negative into the device.  
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