Velocium Products
18 - 20 GHz HPA - APH478
8.5-11.0 GHz GaAs MMIC
Power Amplifier
April 2006 - Rev 14-Apr-06
P1014
1.962
2.412
Mechanical Drawing
(0.077)
(0.095)
1.400
(0.055)
XP1014
Mimix Broadband
I0005129
2
3
TNO © 2005
0.449
0.449
(0.018)
4
1
(0.018)
5
6
0.0
0.0
3.200
1.962
1.662
(0.126)
(0.077)
(0.065)
(Note: Engineering designator is I0005129)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.120 x 0.200 (0.005 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.778 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg)
Bond Pad #6 (Vgg)
Bias Arrangement
Vd1
Vd2
Bypass Capacitors - See App Note [2]
XP1014
Mimix Broadband
I0004966
2
3
TNO © 2005
4
1
RF In
RF Out
5
6
Vgg
Page 3 of 5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
MIMIX [ MIMIX BROADBAND ]
