6.0-18.0 GHz GaAs MMIC
Power Amplifier
August 2007 - Rev 30-Aug-07
CMM0618-BD
0.674
(0.027)
1.531 1.781
(0.060) (0.070)
2.650
(0.104)
Mechanical Drawing
1.980
(0.078)
2
3
4
5
1.023
(0.040)
1
6
1.023
(0.040)
10
0.0
0.0
0.674
(0.027)
9
8
7
2.650 2.815
(0.104) (0.111)
1.531 1.781
(0.060) (0.070)
(Note: Engineering designator is M400)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Gate DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF/Drain DC Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.455 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2 Bypass)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg1 Bypass)
Bond Pad #5 (Vd1)
Bond Pad #6 (RF Out)
Bond Pad #7 (Vd1 Bypass)
Bond Pad #8 (Vg1)
Bond Pad #9 (Vd2 Bypass)
Bond Pad #10 (Vg2)
Bias Arrangement
Vd2
Vd1
Bypass Capacitors
- See App Note [2]
2
3
4
5
RF In
1
6
RF Out
10
9
8
7
Vg2
Vg1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
MIMIX [ MIMIX BROADBAND ]
