27.0-36.0 GHz GaAs MMIC
Transmitter
May 2005 - Rev 20-May-05
27TRX0357
1.133
(0.045)
2.533
(0.100)
2.933
(0.116)
Mechanical Drawing
1.750
(0.069)
2
3
4
1.231
(0.049)
1
tio
5
0.555
(0.022)
uc
8
7
6
9
0.0
0.733
(0.029)
0.0
2.533
(0.100)
2.933 3.333 3.500
(0.116) (0.131) (0.138)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.798 mg.
Bond Pad #1 (RF Out)
Bond Pad #2 (Vg1)
Bond Pad #3 (IF1)
Bond Pad #4 (Vd2)
e-
pr
Vg1
IF1
3
4
7
8
Bond Pad #5 (LO)
Bond Pad #6 (Vg3)
od
5
(Note: Engineering designator is 27TRX0357)
Bond Pad #7 (Vg2)
Bond Pad #8 (IF2)
Bond Pad #9 (Vd1)
Bias Arrangement
Bypass Capacitors
- See App Note [2]
Vd2
2
RF
1
Pr
LO
6
9
Vg2,3
Vd1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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