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AS29F040CW-90/MIL 参数 Datasheet PDF下载

AS29F040CW-90/MIL图片预览
型号: AS29F040CW-90/MIL
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash,]
分类和应用: 可编程只读存储器内存集成电路
文件页数/大小: 26 页 / 1590 K
品牌: MICROSS [ MICROSS COMPONENTS ]
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FLASH  
AS29F040  
TM  
DEVICE BUS OPERATIONS  
Writing Commands/Command Sequences  
This section describes the requirements and use of the  
device bus operations, which are initiated through the internal  
command register. The command register itself does not  
occupy any addressable memory location. The register is  
composed of latches that store the commands, along with the  
address and data information needed to execute the command.  
The contents of the register serve as inputs to the internal state  
machine. The state machine outputs dictate the function of  
the device. The appropriate device bus operations table lists  
the inputs and control levels required, and the resulting output.  
The following subsections describe each of these operations in  
further detail.  
To write a command or command sequence (which includes  
programming data to the device and erasing sectors of memory),  
the system must drive WE\ and CE\ to VIL, and OE\ to VIH.  
An erase operation can erase one sector, multiple sectors,  
or the entire device. The Sector Address Tables indicate the  
address space that each sector occupies. A “sector address”  
consists of the address bits required to uniquely select a sector.  
See the “Command Definitions” section for details on erasing  
a sector or the entire chip, or suspending/resuming the erase  
operation.  
After the system writes the autoselect command sequence,  
the device enters the autoselect mode. The system can then  
read autoselect codes from the internal register (which is separate  
from the memory array) on DQ7 - DQ0. Standard read cycle  
timings apply in this mode. Refer to the “Autoselect Mode” and  
“Autoselect Command Sequence” sections for more information.  
ICC2 in the DC Characteristics table represents the  
active current specification for the write mode. The “AC  
Characteristics” section contains timing specification tables and  
timing diagrams for write operations.  
Requirements for Reading Array Data  
To read array data from the outputs, the system must drive  
the CE\ and OE\ pins to VIL. CE\ is the power control and selects  
the device. OE\ is the output control and gates array data to  
the output pins. WE\ should remain at VIH.  
The internal state machine is set for reading array data upon  
device power-up, or after a hardware reset. This ensures that  
no spurious alteration of the memory content occurs during the  
power transition. No command is necessary in this mode to  
obtain array data. Standard microprocessor read cycles that  
assert valid addresses on the device address inputs produce  
valid data on the device data outputs. The device remains  
enabled for read access until the command register contents  
are altered.  
See “Reading Array Data” for more information. Refer to  
the AC Read Operations table for timing specifications and to  
the Read Operations Timings diagram for the timing waveforms.  
ICC1 in the DC Characteristics table represents the active  
current specification for reading array data.  
Program and Erase Operation Status  
During an erase or program operation, the system may  
check the status of the operation by reading the status bits  
on DQ7 - DQ0. Standard read cycle timings and ICC read  
specifications apply. Refer to “Write Operation Status” for more  
information, and to each AC Characteristics section for timing  
diagrams.  
TABLE 1: DEVICE BUS OPERATIONS  
OPERATION  
Read  
CE\  
OE\  
WE\  
A0 - A20 DQ0 - DQ7  
L
L
H
A
D
OUT  
IN  
IN  
Write  
L
H
X
L
A
D
IN  
CMOS Standby  
V
ꢀ0.V  
X
X
High-Z  
CC  
TTL Standby  
Output Disable  
H
L
X
H
X
H
X
X
High-Z  
High-Z  
NOTES: See the “Sector Protection/Unprotection” section for more information.  
Micross Components reserves the right to change products or specifications without notice.  
AS29F040 Rev. 3.1 07/19  
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