TM
AS29F040
512K x 8 FLASH
FLASH
UNIFORM SECTOR 5.0V FLASH MEMORY
SPECIFICATIONS
Military Equivalent Screening - 883 1.2.2
PIN ASSIGNMENT
(Top View)
32-PIN Ceramic DIP (CW)
32-pin Flatpack (F)
32-pin Lead Formed Flatpack (DCG)
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE\
A17
A14
A13
A8
A9
A11
OE\
A10
CE\
DQ7
DQ6
DQ5
DQ4
DQ3
FEATURES
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Single 5.0V ±10% power supply operation
Fastest access times: 55, 60, 70, 90, 120 & 150ns
Low power consumption:
20 mA typical active read current
30 mA typical program/erase current
1 µA typical standby current (standard access time to
active mode)
Flexible sector architecture
Eight uniform 64 Kbyte each
Any combination of sectors can be erased
Supports full chip erase
Sector protection
Embedded Algorithms Erase & Program Algorithms
Erase Suspend/Resume
Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
Compatible with JEDEC standards
Pinout and software compatible with single-power-
supply FLASH
Data \ Polling and Toggle Bits
20-year data retention at 125°C
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•
•
•
•
•
•
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32-PAD Ceramic LCC (ECA)
A12
A15
A16
A18
VCC
WE\
A17
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
4 3 2
32 31 30
5
1
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
A14
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
OPTIONS
Timing
55ns
60ns
70ns
90ns
120ns
150ns
MARKING
-55
-60
-70
-90
-120
-150
OPTIONS
Package Type
Ceramic DIP (600 mil)
Flatpack
Lead Formed Flatpack
Leadless Chip Carrier
MARKING
CW
F
DCG
ECA
IT
XT**
MIL
For more products and information;
please visit our web site at
www.micross.com
AS29F040
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Rev. 3.1 07/19
Temperature Ranges
Industrial Temperature (-40°C to +85°C)
Military Temperature (-55°C to +125°C)
Military Equivalent Screening - 883 1.2.2
(-55°C to +125°C)
Micross Components reserves the right to change products or specifications without notice.
1
MICROSS [ MICROSS COMPONENTS ]
