PRODUCT DATABOOK 1996/1997
MC33164/MC34164
5 V U
N D E RV O LTA G E
S
E N S I N G
C
I R C U I T
P
R O D U C T I O N
D
A T A
S
H E E T
A B S O L U T E M A X I M U M R AT I N G S
(Note 1)
PACKAGE PIN OUTS
RESET
INPUT
N.C.
GROUND
1
2
3
4
8
7
6
5
N.C.
N.C.
N.C.
N.C.
Input Supply Voltage (V
IN
)............................................................................... -1V to 12V
RESET Output Voltage (V
OUT
) .......................................................................... -1V to 12V
Clamp Diode Forward Current .............................................................................. 100mA
Operating Junction Temperature
Plastic (DM - Package) ......................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
DM PACKAGE
(Top View)
3.
GROUND
T H E R M A L D ATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
156°C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
165°C/W
2.
INPUT
1.
RESET
LP PACKAGE
(Top View)
BLOCK DIAGRAM
INPUT
2(2)
RESET
1(1)
1.2 V
REF
4(3)
GROUND
2
Copyright © 1997
Rev. 1.5 11/97
MICROSEMI [ MICROSEMI CORPORATION ]
