HAL 5xy
1.6. Solderability and Welding
DATA SHEET
Soldering
During soldering reflow processing and manual
reworking, a component body temperature of 260
°C
should not be exceeded.
Welding
Device terminals should be compatible with laser and
resistance welding. Please note that the success of
the welding process is subject to different welding
parameters which will vary according to the welding
technique used. A very close control of the welding
parameters is absolutely necessary in order to reach
satisfying results. Micronas, therefore, does not give
any implied or express warranty as to the ability to
weld the component.
1 V
DD
3
OUT
2, 4
GND
Fig. 1–1:
Pin configuration
6
Jan. 11. 2010; DSH000020_004EN
Micronas
MICRONAS [ MICRONAS ]
