DATA SHEET
HAL401
1.5. Solderability and Welding
Soldering
During soldering reflow processing and manual rework-
ing, acomponentbodytemperatureof260°Cshouldnot
be exceeded.
Welding
Deviceterminalsshouldbecompatiblewithlaserandre-
sistance welding. Please note that the success of the
welding process is subject to different welding parame-
ters which will vary according to the welding technique
used. A very close control of the welding parameters is
absolutely necessary in order to reach satisfying results.
Micronas, therefore, does not give any implied or ex-
press warranty as to the ability to weld the component.
V
DD
1
2
3
OUT1
OUT2
4
GND
Fig. 1–1: Pin configuration
Micronas
5
MICRONAS [ MICRONAS ]
