ADVANCE INFORMATION
DDP 3310B
4.6.3. Recommended Crystal Characteristics
Symbol
Parameter
Pin Name Min.
Typ.
Max.
Unit
fP
Parallel Resonance Frequency
@ CL=16 pF
XTAL1
XTAL2
−
5
−
MHz
RR
Series Resonance Resistance
@ CL=16 pF, fP=5 MHz
−
−
−
−
150
6
Ω
C0
Shunt (Parallel) Capacitance
−
pF
pF
CLext
see
External Load Capacitances (from both
crystal pins connected to GNDD)
27
−
Remarks!
Remarks: External capacitors at each crystal pin to ground are required. They are necessary to tune the effective load
capacitance (including the capacitance of the printed circuit board and the IC package) to the required load
capacitance CL of the crystal. A higher capacitance will result in a lower clock frequency. The exact value of the
matching capacitor should be determined in the actual application (PCB layout).
CLext = 2 (CL − CPCB − CPACK
)
4.6.4. Characteristics
Min./Max. values at: TA = 0 to 65 °C, VSUP(P/D/O) = 4.75 to 5.25 V, Rxref = 10 kΩ, f = 27 MHz
Typical values at: TC = 70 °C, SUP(P/D/O) = 5 V, xref = 10 kΩ, f = 27 MHz
V
R
4.6.4.1. General Characteristics
Symbol
Parameter
Pin Name Min.
Typ.
Max.
Unit
IVSUPO
Current Consumption
Analog Back-end
VSUPO
VSUPD
VSUPP
−
−
−
65
−
mA
IVSUPD
Current Consumption
Digital Processing
225
10
−
−
mA
mA
IVSUPP
Current Consumption
Output Pin Driver
PTOT
IL
Total Power Dissipation
−
−
1.5
−
W
Input and Output Leakage Current
(if not otherwise specified)
−
0.1
µA
Micronas
45
MICRONAS [ MICRONAS ]
