CAP 3001 A
Recommended Operating Conditions, continued
Symbol
Parameter
Pin No.
Min.
Typ.
Max.
Unit
t
IM Bus Data Input Delay after ΦI
0
–
–
–
IM7
IM8
IM9
IM10
Time Clock Input
t
t
t
IM Bus Data Input Setup Time
before ΦI Clock Input
0
0
–
–
–
–
–
–
IM Bus Data Input Hold Time after
ΦI Clock Input
IM Bus Ident End-Pulse Low Time
PDM Capacitor (Low Loss Type)
AGNDC-Filter-Capacitor
Ceramic Capacitor in parallel
Input SCLKI Frequency
1.0
–
–
µs
pF
µF
nF
MHz
ps
%
C
C
14 to 16
18
*5%
680
3.3
100
–
)5%
PDM
AGNDC
f
t
t
t
t
t
54
–
3.1
250
60
–
SCLKI
Input SCLKI Phase Jitter
Input SCLKI Pulse Width
Input Data Setup Time
–
–
SIJ
40
40
0
50
–
SIW
IDS
56, 52
50, 55
ns
–
Input Data Hold Time
–
–
IDH
Input WSI Setup Time
Output WSO Setup Time
40
–
–
ns
WSS
t
Input WSI Hold Time
Output WSO Hold Time
0
–
–
–
WSH
3.1.7. Recommended Crystal Characteristics
Symbol
Parameter
Min.
*20
–
Typ.
Max.
Unit
°C
T
A
Ambient Operating Temperature
Parallel Resonance Frequency
Accuracy of Adjustment
–
)85
–
1)
f
P
16.416
–
MHz
ppm
∆f
S
–
$20
f
S
∆f
Frequency Deviation versus Tem-
perature
–
–
$40
ppm
S
f
S
R
C
C
Series Resistance
–
–
15
7
Ω
r
Shunt Capacitance
Motional Capacitance
Frequency pulling range
5.5
25
350
–
pF
fF
0
1
30
–
–
df
–
ppm
1)
at C +10.7 pF.
L
Remark on defining the external load capacitance: Ex-
ternal capacitors at each crystal pin to ground are re-
quired. The higher the capacity, the lower the clock fre-
quency results. Due to different layouts of customer
PCBs, the matching capacitor size should be defined in
the application.
26
MICRONAS INTERMETALL
MICRONAS [ MICRONAS ]
