P30-65nm
2.0
Package Information
2.1
56-Lead TSOP Package (512-Mbit, 1-Gbit)
Figure 3: TSOP Mechanical Specifications
Z
A
2
See Note 2
See Notes 1 and 3
Pin 1
e
See Detail B
E
Y
D
1
A
1
D
Seating
Plane
See Detail A
A
Detail A
Detail B
C
0
b
L
Table 2:
TSOP Package Dimensions (Sheet 1 of 2)
Millimeters
Nom
Inches
Nom
Product Information
Symbol
Min
Max
Min
Max
Package Height
Standoff
A
-
-
1.200
-
-
-
0.047
-
A
A
0.050
0.965
0.100
0.100
18.200
13.800
-
-
0.002
0.038
0.004
0.004
0.717
0.543
-
-
1
2
Package Body Thickness
Lead Width
0.995
0.150
0.150
18.400
14.000
0.500
20.00
0.600
1.025
0.200
0.200
18.600
14.200
-
0.039
0.006
0.006
0.724
0.551
0.0197
0.787
0.024
0.040
0.008
0.008
0.732
0.559
-
b
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
C
D
1
E
e
Terminal Dimension
Lead Tip Length
D
L
19.800
0.500
20.200
0.700
0.780
0.020
0.795
0.028
Datasheet
9
Sept 2012
OrderNumber:208042-06
MICRON [ MICRON TECHNOLOGY ]
