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MT48LC16M8A2FC-8ELIT 参数 Datasheet PDF下载

MT48LC16M8A2FC-8ELIT图片预览
型号: MT48LC16M8A2FC-8ELIT
PDF下载: 下载PDF文件 查看货源
内容描述: 同步DRAM [SYNCHRONOUS DRAM]
分类和应用: 内存集成电路动态存储器时钟
文件页数/大小: 59 页 / 1835 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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128Mb: x4, x8, x16  
SDRAM  
Data from any READ burst may be truncated with a  
subsequent WRITE command, and data from a fixed-  
length READ burst may be immediately followed by data  
from a WRITE command (subject to bus turnaround  
limitations). The WRITE burst may be initiated on the  
clock edge immediately following the last (or last de-  
sired)dataelementfromtheREADburst, providedthatI/  
O contention can be avoided. In a given system design,  
there may be a possibility that the device driving the  
input data will go Low-Z before the SDRAM DQs go High-  
Z. In this case, at least a single-cycle delay should occur  
between the last read data and the WRITE command.  
The DQM input is used to avoid I/O contention, as  
shown in Figures 9 and 10. The DQM signal must be  
asserted (HIGH) at least two clocks prior to the WRITE  
command (DQM latency is two clocks for output buffers)  
to suppress data-out from the READ. Once the WRITE  
command is registered, the DQs will go High-Z (or re-  
main High-Z), regardless of the state of the DQM signal,  
provided the DQM was active on the clock just prior to  
the WRITE command that truncated the READ com-  
mand. If not, the second WRITE will be an invalid WRITE.  
For example, if DQM was LOW during T4 in Figure 10,  
then the WRITEs at T5 and T7 would be valid, while the  
WRITE at T6 would be invalid.  
The DQM signal must be de-asserted prior to the  
WRITE command (DQM latency is zero clocks for input  
buffers) to ensure that the written data is not masked.  
Figure 9 shows the case where the clock frequency allows  
for bus contention to be avoided without adding a NOP  
cycle, and Figure 10 shows the case where the additional  
NOP is needed.  
T0  
T1  
T2  
T3  
T4  
T5  
T0  
T1  
T2  
T3  
T4  
CLK  
CLK  
DQM  
DQM  
READ  
NOP  
NOP  
NOP  
NOP  
WRITE  
COMMAND  
ADDRESS  
READ  
NOP  
NOP  
NOP  
WRITE  
COMMAND  
ADDRESS  
BANK,  
COL b  
BANK,  
COL n  
BANK,  
COL n  
BANK,  
COL b  
t
HZ  
t
CK  
D
OUT  
n
DIN  
b
DQ  
t
HZ  
t
DS  
D
OUT  
n
DIN b  
DQ  
t
DS  
NOTE:  
A CAS latency of three is used for illustration. The READ command  
may be to any bank, and the WRITE command may be to any bank.  
NOTE:  
A CAS latency of three is used for illustration. The READ  
command may be to any bank, and the WRITE command  
may be to any bank. If a burst of one is used, then DQM is  
not required.  
DONT CARE  
Figure 10  
READ to WRITE With  
Extra Clock Cycle  
Figure 9  
READ to WRITE  
128Mb: x4, x8, x16 SDRAM  
128MSDRAM_E.p65 Rev. E; Pub. 1/02  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2001, Micron Technology, Inc.  
19  
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