64Mb: x32 SDRAM
Package Dimensions
Figure 5: 90-Ball VFBGA (8mm x 13mm) – Package Codes B5
0.65 ±0.05
Seating plane
Solder ball material:
62% Sn, 36% Pb, 2% Ag or
96.5% Sn, 3%Ag, 0.5% Cu
A
0.12 A
Substrate material:
Plastic laminate
Mold compound:
Epoxy novolac
90X Ø0.45
Dimensions apply
to solder balls post
6.40
reflow. The pre-reflow
0.80 TYP
diameter is 0.42 on a
0.40 SMD ball pad.
Ball A1 ID
Ball A1 ID
Ball A9
Ball A1
0.80 TYP
11.20 ±0.10
C
L
13.00 ±0.10
5.60 ±0.05
6.50 ±0.05
C
L
1.00 MAX
3.20 ±0.05
4.00 ±0.05
8.00 ±0.10
1. All dimensions are in millimeters.
Notes:
2. Package width and length do not include mold protrusion; allowable mold protrusion is
0.25mm per side.
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. T 04/13 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
13
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