512Mb : 32 Me g x 16, 16 Me g x 32 Mo b ile SDRAM
Pa cka g e Dim e n sio n s
Pa cka g e Dim e n sio n s
Fig u re 55: 54-Ba ll VFBGA (10m m x 11.5m m )
0.65 ±0.05
Seating
plane
0.1
A
A
Solder ball material:
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
10 ±0.10
54X Ø0.45
Dimensions
5 ±0.05
apply to solder
balls post reflow.
Pre-reflow balls
are Ø0.42 on
Ø0.40 SMD ball
pads.
Ball A1 ID
5.75 ±0.05
Ball A1 ID
9
8
7
3
2
1
A
B
C
D
E
F
3.2
11.5 ±0.1
6.4
G
H
J
0.8 TYP
0.8 TYP
3.2
6.4
1.0 MAX
Notes: 1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.
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