欢迎访问ic37.com |
会员登录 免费注册
发布采购

MT28F400B3VG-8B 参数 Datasheet PDF下载

MT28F400B3VG-8B图片预览
型号: MT28F400B3VG-8B
PDF下载: 下载PDF文件 查看货源
内容描述: FL灰内存 [FLASH MEMORY]
分类和应用:
文件页数/大小: 30 页 / 425 K
品牌: MICRON [ MICRON TECHNOLOGY ]
 浏览型号MT28F400B3VG-8B的Datasheet PDF文件第5页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第6页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第7页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第8页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第10页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第11页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第12页浏览型号MT28F400B3VG-8B的Datasheet PDF文件第13页  
4Mb  
SMART 3 BOOT BLOCK FLASH MEMORY  
PARAMETER BLOCKS  
latched on the falling edge of OE# or CE#, whichever  
The two 8KB parameter blocks store less sensitive and  
more frequently changing system parameters and also  
may store configuration or diagnostic coding. These  
blocks are enabled for erasure when the VPP pin is at VPPH.  
No super-voltage unlock or WP# control is required.  
occurs last. If the contents of the status register change  
during a READ of the status register, either OE# or CE#  
may be toggled while the other is held LOW to update the  
output.  
Following a WRITE or ERASE, the device automati-  
cally enters the status register read mode. In addition, a  
READ during a WRITE or ERASE produces the status  
register contents on DQ0–DQ7. When the device is in the  
erase suspend mode, a READ operation produces the  
status register contents until another command is is-  
sued. In certain other modes, READ STATUS REGIS-  
TER may be given to return to the status register read  
mode. All commands and their operations are described  
in the Command Set and Command Execution sections.  
MAIN MEMORY BLOCKS  
The four remaining blocks are general-purpose  
memory blocks and do not require a super-voltage on  
RP# or WP# control to be erased or written. These blocks  
are intended for code storage, ROM-resident applica-  
tions or operating systems that require in-system update  
capability.  
OUTPUT (READ) OPERATIONS  
IDENTIFICATION REGISTER  
The MT28F004B3 and MT28F400B3 feature three dif-  
ferenttypesofREADs. Dependingonthecurrentmodeof  
the device, a READ operation produces data from the  
memory array, status register or device identification  
register. In each of these three cases, the WE#, CE# and  
OE# inputs are controlled in a similar manner. Moving  
between modes to perform a specific READ is described  
in the Command Execution section.  
A READ of the two 8-bit device identification registers  
requires the same input sequencing as a READ of the  
array. WE# must be HIGH, and OE# and CE# must be  
LOW. However, ID register data is output only on DQ0–  
DQ7, regardless of the condition of BYTE# on the  
MT28F400B3. A0 is used to decode between the two bytes  
of the device ID register; all other address inputs are  
“Don’t Care.” When A0 is LOW, the manufacturer com-  
patibility ID is output, and when A0 is HIGH, the device  
ID is output. DQ8–DQ15 are High-Z when BYTE# is LOW.  
When BYTE# is HIGH, DQ8–DQ15 are 00h when the  
manufacturer compatibility ID is read and 44h when the  
device ID is read.  
To get to the identification register read mode, READ  
IDENTIFICATION may be issued while the device is in  
certainothermodes. Inaddition, theidentificationregis-  
ter read mode can be reached by applying a super-volt-  
age (VID) to the A9 pin. Using this method, the ID register  
can be read while the device is in any mode. When A9 is  
returned to VIL or VIH, the device returns to the previous  
mode.  
MEMORY ARRAY  
To read the memory array, WE# must be HIGH, and  
OE# and CE# must be LOW. Valid data is output on the  
DQ pins when these conditions have been met and a  
valid address is given. Valid data remains on the DQ pins  
untiltheaddresschanges, oruntilOE#orCE#goesHIGH,  
whichever occurs first. The DQ pins continue to output  
new data after each address transition as long as OE# and  
CE# remain LOW.  
The MT28F400B3 features selectable bus widths.  
When the memory array is accessed as a 256K x 16, BYTE#  
is HIGH, and data is output on DQ0–DQ15. To access the  
memory array as a 512K x 8, BYTE# must be LOW, DQ8–  
DQ14 must be High-Z, and all data must be output on  
DQ0–DQ7. The DQ15/A-1 pin becomes the lowest or-  
der address input so that 524,288 locations can be read.  
After power-up or RESET, the device is automatically  
in the array read mode. All commands and their opera-  
tions are described in the Command Set and Command  
Execution sections.  
INPUT OPERATIONS  
The DQ pins are used either to input data to the array  
or to input a command to the CEL. A command input  
issues an 8-bit command to the CEL to control the mode  
of operation of the device. A WRITE is used to input data  
to the memory array. The following section describes  
bothtypesofinputs. Moreinformationdescribinghowto  
use the two types of inputs to write or erase the device is  
provided in the Command Execution section.  
STATUS REGISTER  
Performing a READ of the status register requires the  
same input sequencing as a READ of the array except that  
the address inputs are “Don’t Care.” The status register  
contents are always output on DQ0–DQ7, regardless of  
the condition of BYTE# on the MT28F400B3. DQ8–DQ15  
are LOW when BYTE# is HIGH, and DQ8–DQ14 are High-  
Z when BYTE# is LOW. Data from the status register is  
COMMANDS  
To perform a command input, OE# must be HIGH,  
and CE# and WE# must be LOW. Addresses are “Don’t  
Care” but must be held stable, except during an ERASE  
CONFIRM (described in a later section). The 8-bit com-  
4MbSmart3BootBlockFlashMemory  
F45_3.p65 – Rev. 3, Pub. 12/01  
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.  
©2001,MicronTechnology,Inc.  
9
 复制成功!