256Mb, 3V Multiple I/O Serial Flash Memory
Package Dimensions – Package Code: 12
Package Dimensions – Package Code: 12
Figure 8: 24-Ball T-PBGA (5 x 5 ball grid array) – 6mm x 8mm
Seating plane
0.1 A
A
24X Ø0.4
Dimensions
apply to solder
balls post-reflow
on Ø0.40 SMD
ball pads.
Ball A1 ID
Ball A1 ID
5
4
3
2
1
A
B
C
D
E
4 CTR
8 ±0.1
1 TYP
1.1 ±0.1
1 TYP
4 CTR
6 ±0.1
1. All dimensions are in millimeters.
0.3 ±0.05
Notes:
2. See Part Number Ordering Information for complete package names and details.
CCMTD-1725822587-3368
mt25q-qljs-L256-ABA-xxT.pdf - Rev. K 07/18 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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