256MB, 512MB, 1GB (x72, ECC, DR), PC3200
184-PIN DDR SDRAM UDIMM
Ta b le 21: Se ria l Pre se n ce -De t e ct Ma t rix (Co n t in u e d )
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”
BYTE
DESCRIPTION
ENTRY (VERSION) MT18VDDT3272A MT18VDDT6472A MT18VDDT12872A
31 Module Rank Density
128MB, 256MB,
512MB
20
40
80
32
0.6ns (-40B)
60
60
60
Address And Command Setup Time,
tIS
33 Address And Command Hold Time,
tIH
0.6ns (-40B)
0.4ns (-40B)
0.4ns (-40B)
60
40
40
60
40
40
60
40
40
34
Data/ Data Mask Input Setup Time,
tDS
35
Data/ Data Mask Input Hold Time,
tDH
36-40 Reserved
41
00
37
00
37
00
37
Min Active Auto Refresh Time, tRC
55ns (-40B)
70ns (-40B)
42
46
30
28
50
46
30
28
50
46
30
28
50
Minimum Auto Refresh to Active/
t
Auto Refresh Command Period, RFC
43
12ns (-40B)
0.4ns (-40B)
0.5ns (-40B)
SDRAM Device Max Cycle Time,
tCKMAX
44 SDRAM Device Max DQS-DQ Skew
t
Time, DQSQ
45
SDRAM Device Max Read Data Hold
t
Skew Factor, QHS
46
47
00
00
00
Reserved
01
01
01
DIMM Height
48–61 Reserved
00
00
00
62
63
Release 1.1
-40B
11
11
11
SPD Revision
70
93
D4
Checksum for Bytes 0-62
64 Manufacturer’s JEDEC ID Code
MICRON
(Continued)
01–12
2C
FF
2C
FF
2C
FF
65-71
Manufacturer’s JEDEC ID Code
Manufacturing Location
72
01–0C
01–0C
01–0C
73-90 Module Part Number (ASCII)
Variable Data
01-09
Variable Data
01-09
Variable Data
01-09
91
92
1-9
0
PCB Identification Code
00
00
00
Identification Code (Continued)
93 Year of Manufacture in BCD
Variable Data
Variable Data
Variable Data
–
Variable Data
Variable Data
Variable Data
–
Variable Data
Variable Data
Variable Data
–
94
Week of Manufacture in BCD
Module Serial Number
95-98
99-127 Manufacturer-Specific Data (RSVD)
pdf: 09005aef80814e61, source: 09005aef80a43eed
DDA18C32_64_128x72AG.fm - Rev. E 9/04 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc.
28
MICRON [ MICRON TECHNOLOGY ]
