512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM
Ele ct rica l Sp e cifica t io n s
Ele ct rica l Sp e cifica t io n s
Stresses greater than those listed in Table 8 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in the operational sections of this specifica-
tion is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
Ta b le 8:
Sym b o l
Ab so lu t e Ma xim u m Ra t in g s
Pa ra m e t e r
Min
Ma x
Un it s
VDD/VDDQ
VIN, VOUT
II
–0.5
–0.5
+2.3
+2.3
V
V
VDD supply voltage relative to VSS
Voltage on any pin relative to VSS
Input leakage current; Any input 0V ≤ VIN ≤ VDD;
Command/address,
VREF input 0V ≤ VIN ≤ 0.95V; (All other pins not under RAS#, CAS#, WE#, S#,
–5
+5
µA
test = 0V)
CKE, ODT, BA
CK, CK#
–250
–5
+250
+5
IOZ
Output leakage current; 0V ≤ VOUT ≤ VDDQ; DQs and DQ, DQS, DQS#
µA
ODT are disabled
IVREF
TA
–36
0
+36
+70
+85
+85
+85
µA
°C
°C
°C
°C
VREF leakage current; VREF = Valid VREF level
Module ambient operating temperature
Commercial
Industrial
–40
0
1
TC
DDR2 SDRAM component case operating
temperature2
Commercial
Industrial
–40
Notes: 1. The refresh rate is required to double when 85°C < TC ≤ 95°C.
2. For further information, refer to technical note TN-00-08: Thermal Applications, available
on Micron’s Web site.
In p u t Ca p a cit a n ce
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Co m p o n e n t AC Tim in g a n d Op e ra t in g Co n d it io n s
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades as shown in Table 9.
Ta b le 9:
Mo d u le a n d Co m p o n e n t Sp e e d Gra d e s
Mo d u le Sp e e d Gra d e
Co m p o n e n t Sp e e d Gra d e
-80E
-800
-667
-53E
-40E
-25E
-25
-3
-37E
-5E
PDF: 09005aef80e5e752/Source: 09005aef80e5e626
HTF18C64_128_256x72.fm - Rev. E 3/07 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
7
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