256MB, 512MB, 1GB, 2GB (x64, DR)
184-PIN DDR SDRAM UDIMM
Ta b le 17: DDR SDRAM Co m p o n e n t Ele ct rica l Ch a ra ct e rist ics a n d Re co m m e n d e d
AC Op e ra t in g Co n d it io n s (Co n t in u e d )
Notes: 1–5, 13-15, 29, 48, 49; notes appear on pages 20–23; 0°C ≤ TA ≤ +70°C; VDD = VDDQ = +2.5V ±0.2V
AC CHARACTERISTICS
PARAMETER
-335
-262
-26A/-265
MIN MAX UNITS NOTES
SYMBOL MIN
MAX
MIN
MAX
tISS
0.80
2.2
12
1
1
ns
12
Address and control input setup time (slow slew
rate)
tIPW
2.2
2.2
ns
Address and Control input pulse width (for
each input)
tMRD
tQH
LOAD MODE REGISTER command cycle time
15
15
ns
ns
tHP -
tQHS
tHP -
tQHS
tHP -
tQHS
22, 23
31, 49
DQ-DQS hold, DQS to first DQ to go non-valid,
per access
tQHS
tRAS
0.55
0.75
0.75
ns
ns
ns
Data hold skew factor
42
15
70,000
40
15
120,000
40
20
120,000
ACTIVE to PRECHARGE command
ACTIVE to READ with Auto precharge
command
tRAP
tRC
60
75
60
75
65
75
ns
ns
ACTIVE to ACTIVE/AUTO REFRESH command
period
44
AUTO REFRESH command period 256MB,
512MB, 1GB
tRFC
2GB
120
15
120
15
120
20
ns
ns
tRCD
tRP
tRPRE
tRPST
tRRD
tWPRE
tWPRES
tWPST
tWR
tWTR
na
ACTIVE to READ or WRITE delay
15
0.9
0.4
12
0.25
0
15
0.9
0.4
15
0.25
0
20
0.9
0.4
15
ns
PRECHARGE command period
DQS read preamble
tCK
tCK
ns
1.1
0.6
1.1
0.6
1.1
0.6
38
38
DQS read postamble
ACTIVE bank a to ACTIVE bank b command
DQS write preamble
tCK
ns
0.25
0
DQS write preamble setup time
DQS write postamble
18, 19
17
tCK
ns
0.4
15
1
0.6
0.4
15
1
0.6
0.4
15
0.6
Write recovery time
tCK
ns
Internal WRITE to READ command delay
Data valid output window
1
tQH -tDQSQ
140.6
tQH -tDQSQ
140.6
tQH -tDQSQ
140.6
22
µs
µs
21
21
REFRESH to REFRESH command
interval
256MB
tREFC
tREFI
70.3
70.3
70.3
512MB, 1GB,
2GB
15.6
7.8
15.6
7.8
15.6
7.8
µs
µs
21
21
Average periodic refresh interval 256MB
512MB, 1GB,
2GB
tVTD
tXSNR
tXSRD
Terminating voltage delay to VDD
0
0
0
ns
ns
75
75
75
Exit SELF REFRESH to non-READ command
Exit SELF REFRESH to READ command
tCK
200
200
200
pdf: 09005aef80739fa5, source: 09005aef807397e5
DD16C32_64_128_256x64AG.fm - Rev. C 9/04 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc.
19
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